Advanced PCB Technology
US$3.00-3.20 / Piece
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High-Density 8-Layer PCB for Smartphones Video

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

10-999 Pieces US$3.20

1,000+ Pieces US$3.00

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Shengyi, Kb, Nanya, Ilm
  • Transport Package Vacuum Packaging
  • Specification 39*79mm
  • Trademark XMANDA
  • Origin Made in China
  • Criteria Aql II 0.65
  • Hole Sizes 0.25mm
  • Bevel Edge Yes
  • Impedance 50/90/100 Ohm
  • Trace Width(Min.) 4mil
  • Surfaec Treatment Enig+OSP

Product Description

Specifications: Layers: 8 Thickness:1.6mm Material: FR4 KB6160 Size:39*79mm Surface treatment: ENIG+OSP Line width/spacing: 0.102/0.102mm Minimum aperture: 0.2mm Solder mask color: Black Finished copper thickness: 1/1 OZ Features: 1. The integration of the board design is very ...

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Transaction Info
Price US $ 3.00-3.20/ Piece US $ 0.10-50.00/ Piece US $ 0.01-100.00/ Piece US $ 0.01-150.00/ Piece US $ 0.10-100.00/ Piece
Min Order 10 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms T/T L/C, T/T, D/P, Western Union, Paypal, Money Gram, 30 days net L/C, T/T, D/P, Western Union, Paypal, Money Gram, 30 days net L/C, T/T, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram, 30 days net
Quality Control
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets - North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM OEM OEM OEM OEM
Average Lead Time - Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Shengyi, Kb, Nanya, Ilm;
Criteria: Aql II 0.65;
Hole Sizes: 0.25mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 4mil;
Surfaec Treatment: Enig+OSP;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Board Thickness: 1.6mm;
Copper Thickness: 35um/1oz;
Surface Finish: Immersion Gold/Customized;
Solder Mask: Matt Green/Customized;
Legend: White/Customized;
Type: Rigid Circuit Board;
Dielectric: Copper Base+Fr4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Kb, Shenyi, Rogers, Iteq;
Layer: 1-20 Layers;
Raw Material: Fr-4, Cu Base, High Tg Fr-4, PTFE, Rogers, Teflon etc;
Board Thickness: 0.20mm-8.00mm;
Board Outline Tolerance: +0.10mm;
Minimum Space/Line: 0.075mm;
Surface Finish/Treatment: HASL, Enig, Chem, Tin, Flash Gold, OSP, Gold Finger;
Dielectric: FR-4;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Kingboard;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Board Thickness: 1.6mm;
Copper Finished: 1 Oz;
Surface Finishing: Carbon Ink;
Mask: Matt;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Solder Mask: Green;
Legend: White;
Forming: Scored;
Surface Finish: Immersion Gold, Gold Finger;
Board Thickness: 2.0mm;
Copper Thickness: 70um;
Supplier Name

Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier