High-Density Interconnect Technology
US$3.04-3.05 / Piece
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What is High-Definition Interconnect PCB for Pico Projector

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

10-999 Pieces US$3.05

1,000+ Pieces US$3.04

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Shengyi, Kb, Nanya, Ilm
  • Transport Package Vacuum Packaging
  • Specification 60*40mm
  • Trademark XMANDA
  • Origin Made in China
  • Criteria Aql II 0.65
  • Hole Sizes 0.2mm
  • Bevel Edge Yes
  • Impedance 50/90/100 Ohm
  • Trace Width(Min.) 0.069mm/0.076mm
  • Surfaec Treatment Enig

Product Description

Specifications: Layers:12 Thickness:0.8mm Material: FR-4 Size:60*40mm Surface treatment: ENIG+GOLD FINGER Line width/spacing:0.069mm/0.076mm Minimum aperture:0.2mm Solder mask color:Green Finished copper thickness: 1/1 OZ Features: 1. The integration of the board design is ...

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High-Density Interconnect Technology Comparison
Transaction Info
Price US $ 3.04-3.05/ Piece US $ 1.00-100.00/ Square Meter US $ 1.00-100.00/ Square Meter US $ 1.00-100.00/ Square Meter US $ 1.00-100.00/ Square Meter
Min Order 10 Pieces 1 Square Meters 1 Square Meters 1 Square Meters 1 Square Meters
Trade Terms - - - - -
Payment Terms T/T Online transactions Online transactions Online transactions Online transactions
Quality Control
Management System Certification ISO 9001, ISO 14001, IATF16949 - - - -
Trade Capacity
Export Markets - Domestic Domestic Domestic Domestic
Annual Export Revenue - - - - -
Business Model OEM, ODM - - - -
Average Lead Time - - - - -
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Shengyi, Kb, Nanya, Ilm;
Criteria: Aql II 0.65;
Hole Sizes: 0.2mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 0.069mm/0.076mm;
Surfaec Treatment: Enig;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Supplier Name

Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Shitu Electronics Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Shitu Electronics Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Shitu Electronics Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Shitu Electronics Co., Ltd.

China Supplier - Diamond Member Audited Supplier