2COM 6COM 1 or 2LAN Core I5 2*DDR3 Laptop SODIMM Memory Mini-Itx Motherboard

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

50 Pieces US$165.00-185.00 / Piece

Sepcifications

  • Integrated Graphics Integrated Graphics
  • Main Chipset Intel
  • Maximum Memory Capacity 16G
  • Structure Mini-ITX
  • Memory DDR3
  • SATA Interface SATA3.0
  • Printed Circuit Board Double Layers
  • Main Board Structure Integrated
  • Audio Effects HiFi
  • Specification 170*170mm
  • Trademark Elsky
  • Origin Shenzhen, China

Product Description

2COM 6COM 1 or 2LAN Core i5 2*DDR3 laptop SODIMM Memory Mini-itx Motherboard Form Factor Standard Thin Mini-ITX ,170*170*18mm(L*W*H) Processor QM9600 motherboard supports 6th generation 3855U, 3955U,Core i3/i5/i7 CPU. QM9700 motherboard supports 7th generation 3865U, 3965U,Core i3/i5/i7 CPU. ...

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Transaction Info
Price US $ 165.00-185.00/ Piece US $ 321.00-330.00/ Piece US $ 100/ Piece US $ 138.00-147.00/ Piece US $ 123/ Piece
Min Order 50 Pieces 1 Pieces 10 Pieces 1 Pieces 10 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal
Quality Control
Management System Certification ISO 9001 ISO 9001, HSE, QHSE, EICC ISO 9001, HSE, QHSE, EICC ISO 9001, HSE, QHSE, EICC ISO 9001, HSE, QHSE, EICC
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 16G;
Structure: Mini-ITX;
Memory: DDR3;
SATA Interface: SATA3.0;
Printed Circuit Board: Double Layers;
Main Board Structure: Integrated;
Audio Effects: HiFi;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 48g;
Structure: Z-3.5inch Motherboard;
Memory: DDR4;
SATA Interface: SATA3.0;
CPU Socket: BGA1449;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Audio Effects: 1* Audio 1* I225V-B3 1* I219;
CPU: 11th Tiger Lake-U Series Soc Embedded;
USB: 4*USB3.0 4*USB2.0;
COM: 1* RS422/RS485/RS232 3* RS485/RS232 2* RS232;
LAN: 2* RJ45 1* I225V-B3 1* I219;
Power Supply: DC9-36V;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 8G;
Structure: Nano-Itx;
Memory: DDR4;
SATA Interface: SATA3.0;
CPU Socket: BGA1090;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Audio Effects: Not HiFi;
CPU: 4core Gemini Lake Single CPU;
USB: 2*USB3.0 4*USB2.0;
LAN: 2*I211at;
COM: 4*RS232 2*RS232/RS485 Optional;
Power Supply: DC12-19V;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 32G;
Structure: Nano-Itx;
Memory: DDR4;
SATA Interface: SATA3.0;
CPU Socket: BGA1356;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
CPU: Core 6th I3 I5 I7;
USB: 4*USB3.0 2*USB2.0;
LAN: 6* I211at or I210;
COM: 1*RJ45 Interface RS232 or RS485;
Power Supply: DC 12-19V;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 8G;
Structure: Nano-Itx;
Memory: DDR4;
SATA Interface: SATA3.0;
CPU Socket: BGA1090;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Audio Effects: Not HiFi;
CPU: 4 Core;
USB: 2* USB3.0;
LAN: 4* RJ45 2.5g;
COM: 1* COM RJ45 Console;
Power Supply: DC12-19V 60W;
Supplier Name

Shenzhen Elsky Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Piesia Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Piesia Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Piesia Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Piesia Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier