I5 3317u 3rd Generation Support Cent OS 5.5 RS485 Mini Itx Board Core I3 I5 I7 Industrial Motherboard

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

2-499 Pieces US$90.00

500+ Pieces US$80.00

Sepcifications

  • Integrated Graphics Integrated Graphics
  • Main Chipset Intel
  • Structure Mini-ITX
  • Memory DDR3
  • SATA Interface SATA3.0
  • CPU Socket Slot 1
  • Printed Circuit Board Six Layer
  • Main Board Structure Integrated
  • Audio Effects HiFi
  • Specification 170*170mm
  • Trademark Elsky
  • Origin Shenzhen, China

Product Description

i5 3317U 3rd Generation Support Cent OS 5.5 RS485 Mini ITX Board Core i3 i5 i7 Industrial Motherboard 1007F,1037F,2117F,I3HGP,I5HGP,I7HGP Specification Form Factor Thin Mini-ITX Physical Dimension 170*170*22mm(L*W*H) Processor Option these processors: 1007F:Support dual cores 1.5GHz ...

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Transaction Info
Price US $ 80.00-90.00/ Piece US $ 70.00-90.00/ Piece US $ 70.00-76.00/ Piece US $ 76.00-81.00/ Piece US $ 100.00-279.00/ Piece
Min Order 2 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms T/T, Western Union, Paypal, Money Gram T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal, Money Gram, ALIBABA
Quality Control
Management System Certification ISO 9001 ISO 9001, HSE, QHSE, EICC ISO 9001, HSE, QHSE, EICC ISO 9001, HSE, QHSE, EICC ISO 9001, HSE, QHSE, EICC
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Structure: Mini-ITX;
Memory: DDR3;
SATA Interface: SATA3.0;
CPU Socket: Slot 1;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Audio Effects: HiFi;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 16G;
Structure: ATX;
Memory: DDR3;
SATA Interface: SATA3.0;
CPU Socket: LGA1150;
Printed Circuit Board: Six Layer;
Main Board Structure: Intel B85 Chipest;
Audio Effects: HD Alc662;
Chipest: Intel B85 Chipset;
USB: USB3.0 *USB2.0;
COM: RS232 / RS485 / RS422;
RAM: DDR3 1333/1600MHz;
Network: 1*Rtl8111e 1000m LAN Card;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 32G;
Structure: ATX;
Memory: DDR3;
SATA Interface: SATA3.0;
CPU Socket: LGA1150;
Printed Circuit Board: Six Layer;
Audio Effects: HD Alc662;
Chipest: Intel H81/B85;
USB: USB3.0 *USB2.0;
COM: RS232 / RS485 / RS422;
RAM: Dual Channel DDR3 1333/1600MHz;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 16G;
Structure: ATX;
Memory: DDR3;
SATA Interface: SATA3.0;
CPU Socket: LGA 1155;
Printed Circuit Board: Six Layer;
Main Board Structure: CPU Based;
Audio Effects: HiFi;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 64G;
Structure: Nuc;
Memory: DDR4;
SATA Interface: SATA3.0;
CPU Socket: BGA;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
CPU: Adopt Intel 11th Tiger Lake Celeron, Core I3/I5/I7;
Technology Architecture: Dual Channel DDR4 2400/2666/3200MHz;
RAM Sockets: 2 *DDR4 SODIMM 260 Socket;
Controller: 2*Intel I211at or Intel I210 or I225;
USB: 4*USB2.0 2*USB3.1 Gen2, 1*Type-C USB3.1 Gen2;
Serial Port: 1*RS-232(Ttl Level Can Be Changed);
Mini-Pcle: 1*Mini-Pcie Socket Support Pcie and USB Device;
Ngff: Pcie X2 Nvme or SATA Signal 2242 M2 Hard Disk;
Warranty: 2 Years;
Power Supply: DC 12-19vpower Supply;
Supplier Name

Shenzhen Elsky Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Piesia Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Piesia Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Piesia Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Piesia Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier