Elsky Qm8000 Core I3 I5 I7 I5 I3 Processor LGA 1150 Motherboard with Pcie 4X Lvds HD-Mi VGA Motherboard with Processor

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-99 Pieces US$88.00

100+ Pieces US$83.00

Sepcifications

  • Integrated Graphics Integrated Graphics
  • Main Chipset Intel
  • Maximum Memory Capacity 8G
  • Memory DDR3
  • SATA Interface SATA
  • CPU Socket LGA 1150
  • Printed Circuit Board Six Layer
  • Main Board Structure Integrated
  • Specification 1Piece/Carton(G. W.: 1.0-1.5KG); 5Pieces/Carton(G
  • Trademark inter smart
  • Origin Shenzhen
  • Chipset Manufacture Intel
  • Socket Type Fclga1150
  • Memory Type DDR3, 1*Laptop DDR3 1333/1600MHz Memory Channe
  • Hard Drive Interface SATA, 2*SATA3.0 Ports, 1*Msata3.0 Slot
  • Architecture Intel X86
  • Ethernet Optional 2LAN
  • Test Condition 100% 24~72 Hours Burnin Test
  • Graphics Card Type Integrated-Need CPU Support

Product Description

Different configurations have different prices, if you would like to know more about the specific price, please feel free to contact us. Product Description ELSKY QM8000 Core i3 i5 i7 i5 i3 Processor LGA 1150 Motherboard with PCIE 4X LVDS HD-MI VGA motherboard with processor QM8000 Motherboard ...

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I3 Processor and Motherboard Comparison
Transaction Info
Price US $ 83.00-88.00/ Piece US $ 175/ Piece US $ 118/ Piece US $ 100.00-122.00/ Piece US $ 67.00-71.00/ Piece
Min Order 1 Pieces 1 Pieces 10 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, Western Union, Money Gram T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal
Quality Control
Management System Certification ISO 9001 ISO 9001, HSE, QHSE, EICC ISO 9001, HSE, QHSE, EICC ISO 9001, HSE, QHSE, EICC ISO 9001, HSE, QHSE, EICC
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 8G;
Memory: DDR3;
SATA Interface: SATA;
CPU Socket: LGA 1150;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Chipset Manufacture: Intel;
Socket Type: Fclga1150;
Memory Type: DDR3, 1*Laptop DDR3 1333/1600MHz Memory Channe;
Hard Drive Interface: SATA, 2*SATA3.0 Ports, 1*Msata3.0 Slot;
Architecture: Intel X86;
Ethernet: Optional 2LAN;
Test Condition: 100% 24~72 Hours Burnin Test;
Graphics Card Type: Integrated-Need CPU Support;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 12GB;
Structure: Z-3.5inch Motherboard;
Memory: DDR3;
SATA Interface: SATA3.0;
CPU Socket: BGA;
Main Board Structure: Integrated;
Audio Effects: HD Alc662;
CPU: Apollo Lake Series Processor;
USB: 2*USB3.0 6*USB2.0;
LAN: 2*Intel I211;
COM: 5*RS-232 1*RS422/485(Optional);
Power Supply: 8-36V 35W;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 8G;
Structure: Nano Board;
Memory: DDR3;
SATA Interface: SATA3.0;
CPU Socket: BGA;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Audio Effects: HiFi;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 32G;
Structure: Mini-ITX;
Memory: DDR4;
SATA Interface: SATA3.0;
CPU Socket: BGA;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Audio Effects: HiFi;
Integrated Graphics: Integrated Graphics;
Main Chipset: Intel;
Maximum Memory Capacity: 8G;
Structure: Mini-ITX;
Memory: DDR4;
SATA Interface: SATA3.0;
CPU Socket: BGA;
Printed Circuit Board: Six Layer;
Main Board Structure: Integrated;
Audio Effects: HiFi;
Supplier Name

Shenzhen Elsky Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Piesia Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Piesia Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Piesia Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Piesia Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier