Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Test: 100% E-Test;
Surface Treatment: 100% Tin;
Board Thickness: 0.2-6mm;
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Solder Mask: Green;
Layers: 1-36 Layers;
Copper Thickness: 0.5-12oz(18-420um);
a Special Process: Carbon Film Printing;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: OEM;
OEM & ODM: Conformal Coating, PCB Layout, PCB Clone;
PCB Material: Fr4, Cem1-Cem3, Rogers, Aluminum/Copper Based;
PCBA Layer: 1-32 Layers;
Copper Foil: 18um-210um(6oz);
Surface Finish: Enig/ HASL/Immersion Gold/OSP/ Golden Plated;
Certificates: ISO9001/IATF16949/ISO13485/CE/RoHS;
Solder Mask: Green;Red;Yellow;Black;White;
Test: X-ray, Aoi, in-Circuit Test(Ict), Functional Test;
OEM: SMT&DIP&Pth&BGA Assembly;
PCB Service: PCB Assembly, PCB/PCBA Design, PCBA Copy;
Components Range: Qfn, BGA, 01005, 0201, 0402, 0603, 0805, 1206, 1608, 2125;
Quality Standard: Ipc-a-610 Class II & III, Ipc-a-620 Class II & III;
RoHS: RoHS/Lead Free Compliance;
EMS Service: Chip Programming & Function Test, Box Build Assemb;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
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