Specification |
Mode of Production: SMT;
Layers: 1-28 Layers;
Customized: Customized;
Condition: New;
PCBA Min. IC Pitch: 0.30mm(12mil);
PCBA Min. Chip Placement: 0201;
Item: Electronic PCB Board Assembly;
Other PCBA Service: Conformal Coating;
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
Turnkey Service: PCB, PCB Assembly, Box Build;
Applicaton: Industrial PCB PCBA;
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Metal Coating: Copper;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Type: Rigid Circuit Board;
Dielectric: Fr-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Insulation Materials: Epoxy Resin;
Processing Technology: Immersion Gold;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Technology: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
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Metal Coating: Copper;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Type: Rigid Circuit Board;
Dielectric: Fr-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Insulation Materials: Epoxy Resin;
Processing Technology: Immersion Gold;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Technology: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
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Metal Coating: Tin;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Testing: Spi,Aoi,Ict,Fct,X-ray,RoHS and Aging.;
Min. Component: 01005;
Max. PCB Mulitylayer: up to 64 Layers;
Max PCB Dimension: 740*400mm;
MOQ: Orders of Small or Medium Quantity Is Welcomed;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
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