Specification |
Metal Coating: Silver;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Capacity: 100 000 PCS/Month;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Testing: X-ray, Aoi, Ict, Fct;
Small Order: Acceptable;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Material: Complex;
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Metal Coating: Tin;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Processing Technology: Electrolytic Foil;
Layer: 1-18 Layer;
Surface Finishing: HASL, Enig, OSP, Immersion Au, AG, Sn;
Min.Hole Size: 0.1mm (4 Mil);
Min.Line Spacing: 0.2mm-4mm;
Copper Thickness: 0.5oz, 1oz, 2oz;
Board Thickness: 0.2mm-4mm;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test);
Delivery: PCB, 7-15days;PCBA, 2-3weeks;
Service: Printed Circuit Board PCBA Board, SMT, Tht, Test;
Other Service: PCBA Layout and Design, Engineering Support;
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Metal Coating: Tin;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Processing Technology: Electrolytic Foil;
Layer: 1-18 Layer;
Surface Finishing: HASL, Enig, OSP, Immersion Au, AG, Sn;
Min.Hole Size: 0.1mm (4 Mil);
Min.Line Spacing: 0.2mm-4mm;
Copper Thickness: 0.5oz, 1oz, 2oz;
Board Thickness: 0.2mm-4mm;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test);
Delivery: PCB, 7-15days;PCBA, 2-3weeks;
Service: Printed Circuit Board PCBA Board, SMT, Tht, Test;
Other Service: PCBA Layout and Design, Engineering Support;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: 1~28 Layers;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Basic Material: Fr4;
PCBA Testing: X-ray, Aoi Test, Function Test;
Certificate: RoHS, UL / ISO9001, ISO13485, IATF16949;
Other Service: ODM, OEM, Final Product Assembling;
Board Service: Board Assembly;
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