Motherboard
US$16.50-17.50 / Piece
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What is LED SMT PCB Special Usage Solder Paste

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

100-499 Pieces US$17.50

500+ Pieces US$16.50

Sepcifications

  • Metal Coating Tin
  • Mode of Production SMT
  • Layers Single-Layer
  • Certification RoHS, CCC, ISO, SGS
  • Customized Customized
  • Condition New
  • Transport Package Customized
  • Specification 250g 500g
  • Trademark Customized
  • Origin China
  • Color Grey
  • Package 500g/Bottle

Product Description

Guangdong Zhongshi Metals Co., Ltd Founded in 1999, high-tech enterprises, designated supplier of welding materials for national aerospace industries. registered capital 22 million, has passed the ISO9001, ISO14001 and QC080000 certification. Main products are solder paste, solder wire, solder ...

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Motherboard Comparison
Transaction Info
Price US $ 16.50-17.50/ Piece US $ 2/ Piece US $ 2/ Piece US $ 30/ kg US $ 2/ Piece
Min Order 100 Pieces 1 Pieces 1 Pieces 50 kg 1 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T L/C, T/T, Western Union L/C, T/T, Western Union T/T, Western Union, Paypal, Money Gram L/C, T/T, Western Union
Quality Control
Product Certification RoHS, CCC, ISO, SGS RoHS, ISO RoHS, ISO ISO RoHS, ISO
Management System Certification ISO 9001, ISO 14001, ISO 14000, QC 080000 ISO 9001 ISO 9001 ISO 9001, ISO 14001 ISO 9001
Trade Capacity
Export Markets Domestic South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM, Own Brand OEM OEM OEM, ODM, Own Brand OEM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Metal Coating: Tin;
Mode of Production: SMT;
Layers: Single-Layer;
Customized: Customized;
Condition: New;
Color: Grey;
Package: 500g/Bottle;
Metal Coating: Copper;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Type: Rigid Circuit Board;
Dielectric: Fr-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Insulation Materials: Epoxy Resin;
Processing Technology: Immersion Gold;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Technology: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
Metal Coating: Copper;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Type: Rigid Circuit Board;
Dielectric: Fr-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Insulation Materials: Epoxy Resin;
Processing Technology: Immersion Gold;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Technology: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
Metal Coating: Tin;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Alloy: Tin Lead;
Powder Size: Type 3: 25 to 45 Microns;
Powder Size 2: Type 4: 20 to 38 Microns;
Flux: No Clean Flux;
Alloy 2: Sn63pb37;
Alloy 3: Sn60pb40;
Alloy 4: Sn55pb45;
Alloy 5: Sn50pb50;
Packing: Jar;
Packing 2: Syringe;
Shipping: Courier / Air Freight;
Shelf Life: 6months;
Storage: 0 to 10 Degree Celsius;
Application: SMT;
Application 2: SMD;
Metal Coating: Copper;
Mode of Production: DIP;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Type: Rigid Circuit Board;
Dielectric: Fr-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Insulation Materials: Epoxy Resin;
Processing Technology: Immersion Gold;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Technology: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
Supplier Name

Guangdong Zhong Shi Metals Co., Ltd

China Supplier - Diamond Member Audited Supplier

Shenzhen Hemeixin Electronic Co., Limited

China Supplier - Diamond Member Audited Supplier

Shenzhen Hemeixin Electronic Co., Limited

China Supplier - Diamond Member Audited Supplier

Foshan Xi Feng Tin Products Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzhen Hemeixin Electronic Co., Limited

China Supplier - Diamond Member Audited Supplier