What is Flexible PCB Assembly and Manufacturing Service

Name: Flexible PCB Assembly and Manufacturing Service
Uploaded: 2023-12-26T17:19:59+08:00
Description: Welcome to ZINPON PCB! As your reliable PCB fabrication service, ZINPON PCB takes pride in delivering top-notch products to customers worldwide. With over ten years of experience, we have built a

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About this Item

Price

Min. Order Reference FOB Price

1 Square Meter US$1.00-10.00 / Square Meter

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Polyester Glass Fiber Mat Laminate
Application Communication
Flame Retardant Properties V0
Processing Technology Electrolytic Foil
Production Process Subtractive Process
Base Material Copper
Insulation Materials Organic Resin
Brand Zinpon Electronics
Transport Package Vacuum Package with Desiccant and Humidity Cards
Specification 650mm*1200mm
Trademark Customized
Origin China
Surface Treatment Enig2u′
Soldermask Customized
Customization Available
Certificate UL#ISO9001#ISO45001#IATF16949

Product Description

Welcome to ZINPON PCB! As your reliable PCB fabrication service, ZINPON PCB takes pride in delivering top-notch products to customers worldwide. With over ten years of experience, we have built a stellar reputation in Europe, America, Japan, and other Asia-Pacific countries. At ZINPON PCB, ...

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Shenzhen Zinpon Electronics Co, Ltd

Diamond Member Since 2023

Audited Supplier

Business Type Manufacturer/Factory
Main Products Printed Circuit Boards, PCBA, Industry Magnets Material Supply
Registered Capital 1000000 RMB
Plant Area >2000 square meters
Management System Certification ISO 9001, ISO 14001, OHSAS/ OHSMS 18001, IATF16949, HSE, GMP, BRC, QHSE, ISO 13485, BREEAM, SHE Audits, FSC, ISO 17025
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Flexible PCB Assembly Comparison

	Quick View Flexible PCB Assembly and Manufacturing Service Contact Now	Quick View HDI High Density Interconnect Industrial Visualizer PCB 10layer Em825 Enig 3mil Contact Now	Quick View Ipc Industrial Computer HDI 4layer HASL-Lf Material Gw1500 PCB Contact Now	Quick View Industrial PC High Density Interconnect 18layer PCB 2.4mm OSP Contact Now	Quick View Automotive Fleet Management System HDI PCB 4layer Enig Em825 Contact Now

Transaction Info
	Quick View Flexible PCB Assembly and Manufacturing Service Contact Now	Quick View HDI High Density Interconnect Industrial Visualizer PCB 10layer Em825 Enig 3mil Contact Now	Quick View Ipc Industrial Computer HDI 4layer HASL-Lf Material Gw1500 PCB Contact Now	Quick View Industrial PC High Density Interconnect 18layer PCB 2.4mm OSP Contact Now	Quick View Automotive Fleet Management System HDI PCB 4layer Enig Em825 Contact Now
Price	US $ 1.00-10.00/ Square Meter	US $ 3.26-24.80/ Piece	US $ 1.05-7.96/ Piece	US $ 3.69-32.80/ Piece	US $ 0.967-8.58/ Piece
Min Order	1 Square Meters	100 Pieces	100 Pieces	100 Pieces	100 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T, D/P, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal
Quality Control
Product Certification	UL#ISO9001#ISO45001#IATF16949	-	-	-	-
Management System Certification	ISO 9001, ISO 14001, OHSAS/ OHSMS 18001, IATF16949, HSE, GMP, BRC, QHSE, ISO 13485, BREEAM, SHE Audits, FSC, ISO 17025	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe	North America, Europe, Southeast Asia/ Mideast	North America, Europe, Southeast Asia/ Mideast	North America, Europe, Southeast Asia/ Mideast	North America, Europe, Southeast Asia/ Mideast
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM, Own Brand	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Zinpon Electronics; Surface Treatment: Enig2u'; Soldermask: Customized; Customization: Available;	Structure: HDI PCB; Dielectric: Fr4 Em825; Material: Epoxy Paper Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Enig; Production Process: Blind&Buried Vias; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: 10layer - 18layer; HDI Structure: 1+N+1 to Any Layer; Min. Trace/Space: 2/2mil; Blind/Buried Vias: 0.1mm Laser Drilling;	Structure: HDI PCB; Dielectric: Fr4 Gw1500; Material: Epoxy Paper Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Enig; Production Process: Blind&Buried Vias; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: 4layer - 18layer; HDI Structure: 1+N+1 to Any Layer; Min. Trace/Space: 2/2mil; Blind/Buried Vias: 0.1mm Laser Drilling;	Structure: HDI PCB; Dielectric: Fr4 Tg170 2.0/2.4mm; Material: Epoxy Paper Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Enig, OSP; Production Process: Blind&Buried Vias; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: 12layer - 18layer; HDI Structure: 1+N+1 to Any Layer; Min. Trace/Space: 2/2mil; Blind/Buried Vias: 0.1mm Laser Drilling; Unit Size: 609.6mm X 457.2mm;	Structure: HDI PCB; Dielectric: Fr4 Em825 1.0mm; Material: Epoxy Paper Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Enig; Production Process: Blind&Buried Vias; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: 4layer - 18layer; HDI Structure: 1+N+1 to Any Layer; Min. Trace/Space: 2/2mil; Blind/Buried Vias: 0.1mm Laser Drilling;
Supplier Name	Shenzhen Zinpon Electronics Co, Ltd	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.
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