Rigid-Flex Circuit Board Assembly
US$1.00-10.00 / Square Meter
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What is Rigid-Flex Circuit Board Assembly with Available Customization

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Square Meter US$1.00-10.00 / Square Meter

Sepcifications

  • Structure Multilayer Rigid PCB
  • Dielectric FR-4
  • Material Nelco Arlon Isola
  • Application Communication
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Production Process Subtractive Process
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Brand Zinpon Electronics
  • Transport Package Vacuum Package with Desiccant and Humidity Cards
  • Specification 650mm*1200mm
  • Trademark Customized
  • Origin China
  • Surface Treatment Enig2u′
  • Soldermask Customized
  • Customization Available
  • Certificate UL#ISO9001#ISO45001#IATF16949

Product Description

ZINPON PCB - Rigid-Flex Circuit Board Assembly Company Profile Welcome to the world of high-density multi layer PCBs with ZINPON PCB! With over ten years of expertise, we are a leading manufacturer that has captured the hearts of English-speaking natives worldwide. Our top-notch products ...

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Rigid-Flex Circuit Board Assembly Comparison
Transaction Info
Price US $ 1.00-10.00/ Square Meter Negotiable Negotiable Negotiable Negotiable
Min Order 1 Square Meters 50 Square Meters 50 Square Meters 50 Square Meters 50 Square Meters
Trade Terms - - - - -
Payment Terms T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T L/C, T/T L/C, T/T L/C, T/T
Quality Control
Product Certification UL#ISO9001#ISO45001#IATF16949 - - - -
Management System Certification ISO 9001, ISO 14001, OHSAS/ OHSMS 18001, IATF16949, HSE, GMP, BRC, QHSE, ISO 13485, BREEAM, SHE Audits, FSC, ISO 17025 - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Europe North America, South America, Europe North America, South America, Europe North America, South America, Europe
Annual Export Revenue - > US $100 Million > US $100 Million > US $100 Million > US $100 Million
Business Model OEM, ODM, Own Brand Own Brand Own Brand Own Brand Own Brand
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Nelco Arlon Isola;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Zinpon Electronics;
Surface Treatment: Enig2u';
Soldermask: Customized;
Customization: Available;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: PTFE;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Size: Customization;
Tensile Strength: Excellent;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: PTFE;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Size: Customization;
Tensile Strength: Excellent;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: PTFE;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Size: Customization;
Tensile Strength: Excellent;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: PTFE;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Size: Customization;
Tensile Strength: Excellent;
Supplier Name

Shenzhen Zinpon Electronics Co, Ltd

China Supplier - Diamond Member Audited Supplier

Shandong Senrong New Materials Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shandong Senrong New Materials Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shandong Senrong New Materials Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shandong Senrong New Materials Co., Ltd.

China Supplier - Diamond Member Audited Supplier