What is High-Frequency Electronic PTFE Taconic PCB High Temperature PCB Applications

Name: High-Frequency Electronic PTFE Taconic PCB High Temperature PCB Applications
Uploaded: 2023-11-18T18:34:32+08:00
Description: 1.Company Profile ZINPON PCB is a leading manufacturer of high-density multi layer PCBs with more than ten years experience. 60% products are sold to Europe, America, Japan and other Asia-pacific cou

Contact Now

Get Latest Price

About this Item

Price

Min. Order Reference FOB Price

1 Square Meter US$1.00-10.00 / Square Meter

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Nelco Arlon Isola
Application Communication
Flame Retardant Properties V0
Processing Technology Electrolytic Foil
Production Process Subtractive Process
Base Material Copper
Insulation Materials Organic Resin
Brand Zinpon Electronics
Transport Package Vacuum Package with Desiccant and Humidity Cards
Specification 650mm*1200mm
Trademark Customized
Origin China
Surface Treatment Enig2u′
Soldermask Customized
Customization Available
Certificate UL#ISO9001#ISO45001#IATF16949

Product Description

1.Company Profile ZINPON PCB is a leading manufacturer of high-density multi layer PCBs with more than ten years experience. 60% products are sold to Europe, America, Japan and other Asia-pacific countries. The high quality of our products and short lead time brought us reputation and recognition ...

Learn More

Shenzhen Zinpon Electronics Co, Ltd

Diamond Member Since 2023

Audited Supplier

Business Type Manufacturer/Factory
Main Products Printed Circuit Boards, PCBA, Industry Magnets Material Supply
Registered Capital 1000000 RMB
Plant Area >2000 square meters
Management System Certification ISO 9001, ISO 14001, OHSAS/ OHSMS 18001, IATF16949, HSE, GMP, BRC, QHSE, ISO 13485, BREEAM, SHE Audits, FSC, ISO 17025
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

SMT PCB Comparison

	Quick View High-Frequency Electronic PTFE Taconic PCB High Temperature PCB Applications Contact Now	Quick View Tg180 Impedance Control 14layer Imm Tin Circuit PCB for Telecommunication Contact Now	Quick View Fr4 Tg170 4.8mm Thickness 14layer Enig Round Motherboard PCB Contact Now	Quick View Shengyi Material Tg180 Impedance Control 16layer Enig Circuit Board PCB for Military Board Contact Now	Quick View Item Material Tg180 16layer Impedance Control Enig Motherboard PCB for Telecommunication Contact Now

Transaction Info
	Quick View High-Frequency Electronic PTFE Taconic PCB High Temperature PCB Applications Contact Now	Quick View Tg180 Impedance Control 14layer Imm Tin Circuit PCB for Telecommunication Contact Now	Quick View Fr4 Tg170 4.8mm Thickness 14layer Enig Round Motherboard PCB Contact Now	Quick View Shengyi Material Tg180 Impedance Control 16layer Enig Circuit Board PCB for Military Board Contact Now	Quick View Item Material Tg180 16layer Impedance Control Enig Motherboard PCB for Telecommunication Contact Now
Price	US $ 1.00-10.00/ Square Meter	US $ 1.15-7.20/ Piece	US $ 1.82-7.36/ Piece	US $ 1.27-6.28/ Piece	US $ 2.12-8.50/ Piece
Min Order	1 Square Meters	100 Pieces	100 Pieces	100 Pieces	100 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T, D/P, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal
Quality Control
Product Certification	UL#ISO9001#ISO45001#IATF16949	-	-	-	-
Management System Certification	ISO 9001, ISO 14001, OHSAS/ OHSMS 18001, IATF16949, HSE, GMP, BRC, QHSE, ISO 13485, BREEAM, SHE Audits, FSC, ISO 17025	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE	ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM, Own Brand	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Nelco Arlon Isola; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Zinpon Electronics; Surface Treatment: Enig2u'; Soldermask: Customized; Customization: Available;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Telecommunication; Flame Retardant Properties: V0; Processing Technology: Enig; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: up to 64; Cu Thickness: up to 12oz; Board Thickness: up to 8mm; Inner Core Material: 0.1mm Tg180; Surface Finish: Immersiong Gold; Other: Impedance Control;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Enig; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: up to 64; Cu Thickness: up to 12oz; Board Thickness: up to 8mm; Min. Hole to Line: 8mil; Counterbore Hole: 8.2mm/Depth 2.0mm; Pressure Holes: 1.0mm;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Enig; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: 1; Layer Count: up to 64; Cu Thickness: up to 12oz; Board Thickness: up to 8mm; Min. Hole to Line: 8mil; Surface Finish: Immersiong Gold; Other: Impedance Control 3mil;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxy Paper Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Enig; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Layer Count: up to 64; Cu Thickness: up to 12oz; Board Thickness: up to 8mm; Min. Hole to Line: 8mil; Surface Finish: Immersiong Gold; Other: Impedance Control 3mil;
Supplier Name	Shenzhen Zinpon Electronics Co, Ltd	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.	Shanghai Gawin Electronic Technology Co., Ltd.
Select All

Contact Now

Hot Search