PCB Fabrication Services
US$1.00-10.00 / Square Meter
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What is EMS Services for PCB Assembly and Fabrication Producer

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Square Meter US$1.00-10.00 / Square Meter

Sepcifications

  • Structure Multilayer Rigid PCB
  • Dielectric FR-4
  • Material Polyester Glass Fiber Mat Laminate
  • Application Communication
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Production Process Subtractive Process
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Brand Zinpon Electronics
  • Transport Package Vacuum Package with Desiccant and Humidity Cards
  • Specification 650mm*1200mm
  • Trademark Customized
  • Origin China
  • Surface Treatment Enig2u′
  • Soldermask Customized
  • Customization Available
  • Certificate UL#ISO9001#ISO45001#IATF16949

Product Description

1. Company Profile Welcome to ZINPON PCB, a leading manufacturer of high-density multi-layer PCBs with over ten years of experience. Our commitment to quality and efficiency has earned us a reputation and recognition worldwide. With 60% of our products sold to Europe, America, Japan, and other ...

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PCB Fabrication Services Comparison
Transaction Info
Price US $ 1.00-10.00/ Square Meter US $ 1.10-1.70/ Piece US $ 1/ Piece US $ 1/ Piece US $ 0.20-0.60/ Piece
Min Order 1 Square Meters 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - FOB, DDP, DAP FOB, DDP, DAP FOB, DDP, DAP FOB, CFR, CIF, DDP, DAP, EXW
Payment Terms T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, Paypal L/C, T/T L/C, T/T L/C, T/T, Western Union, Paypal
Quality Control
Product Certification UL#ISO9001#ISO45001#IATF16949 - - - -
Management System Certification ISO 9001, ISO 14001, OHSAS/ OHSMS 18001, IATF16949, HSE, GMP, BRC, QHSE, ISO 13485, BREEAM, SHE Audits, FSC, ISO 17025 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM, Own Brand OEM OEM OEM OEM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Zinpon Electronics;
Surface Treatment: Enig2u';
Soldermask: Customized;
Customization: Available;
Structure: Rigid-Flex;
Dielectric: Polyimide&Fr4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Computer;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Polyimide&Fr4;
Insulation Materials: Epoxy Resin;
Brand: Uc;
Layer: 8;
Thickness: 2.0mm;
Hole: 03mm;
Surface: Enig;
Structure: Rigid-Flex;
Dielectric: Polyimide&Fr4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Computer;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Polyimide&Fr4;
Insulation Materials: Epoxy Resin;
Brand: Uc;
Layer: 4;
Thickness: 0.55mm;
Hole: 0.3mm;
Surface: Enig;
Structure: Rigid-Flex;
Dielectric: Polyimide&Fr4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Computer;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Polyimide&Fr4;
Insulation Materials: Epoxy Resin;
Brand: UC;
Layer: 4;
Thickness: 0.4mm;
Surface: Enig;
Space: 0.12mm;
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Surface Finish: Enig/1u'';
Layer: 1-24;
Base: Fr-4 (Tg110-180), Rogers, Shenyi;
Material Finished Thickness: 0.2-5.0mm;
Finished Copper Thickness: 1oz;
Surface Treatment: Immersion Gold/HASL Lead Free/ Immersion Silve;
Solder Mask Color: Green/White/Black/Blue/Red;
PCB Testing: E-Testing, Flying Probe Testing;
Lead Time: 8 Working Days;
Fast Turn: 3 Working Days;
Supplier Name

Shenzhen Zinpon Electronics Co, Ltd

China Supplier - Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

China Supplier - Diamond Member Audited Supplier