Bluetooth PCB Module

US$1.00-10.00 / Square Meter

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Rigid-Flex PCB for Bluetooth Module Circuit Board pictures & photos

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What is Rigid-Flex PCB for Bluetooth Module Circuit Board

Name: Rigid-Flex PCB for Bluetooth Module Circuit Board
Uploaded: 2023-12-25T14:51:50+08:00
Description: Rigid-Flex PCB for Bluetooth Module Circuit Board Shenzhen Zinpon Electronics Co, Ltd specializes in the manufacturing of high-quality Rigid-Flex PCBs for Bluetooth module circuit boards. With ove

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About this Item

Price

Min. Order Reference FOB Price

1 Square Meter US$1.00-10.00 / Square Meter

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Nelco Arlon Isola
Application Communication
Flame Retardant Properties V0
Processing Technology Electrolytic Foil
Production Process Subtractive Process
Base Material Copper
Insulation Materials Organic Resin
Brand Zinpon Electronics
Transport Package Vacuum Package with Desiccant and Humidity Cards
Specification 650mm*1200mm
Trademark Customized
Origin China
Surface Treatment Enig2u′
Soldermask Customized
Customization Available
Certificate UL#ISO9001#ISO45001#IATF16949

Product Description

Rigid-Flex PCB for Bluetooth Module Circuit Board Shenzhen Zinpon Electronics Co, Ltd specializes in the manufacturing of high-quality Rigid-Flex PCBs for Bluetooth module circuit boards. With over ten years of experience, we have gained a reputation for our exceptional products and short lead ...

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Shenzhen Zinpon Electronics Co, Ltd

Diamond Member Since 2023

Audited Supplier

Business Type Manufacturer/Factory
Main Products Printed Circuit Boards, PCBA, Industry Magnets Material Supply
Registered Capital 1000000 RMB
Plant Area >2000 square meters
Management System Certification ISO 9001, ISO 14001, OHSAS/ OHSMS 18001, IATF16949, HSE, GMP, BRC, QHSE, ISO 13485, BREEAM, SHE Audits, FSC, ISO 17025
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Bluetooth PCB Module Comparison

	Quick View Rigid-Flex PCB for Bluetooth Module Circuit Board Contact Now	Direct Manufacturer Fr-4 Copper Clad Laminats, Cem-1, Fr-2 Copper Clad Laminats, Xpc, Flexible Ccl Contact Now	Quick View China PCB Printed Circuit Board for SMT/EMS/OEM/ODM Multilayer HDI PCB Design for Electronics Contact Now	Quick View PCB Manufacturer Mother Board PCB Factory Double Sided/2layer Fr4 PCB Circuit Board Fabricator Contact Now	Quick View Wholesale Rigid PCB Board, Multilayer Printed Circuit Board with Gold Finger for Electronics Used Contact Now

Transaction Info
	Quick View Rigid-Flex PCB for Bluetooth Module Circuit Board Contact Now	Direct Manufacturer Fr-4 Copper Clad Laminats, Cem-1, Fr-2 Copper Clad Laminats, Xpc, Flexible Ccl Contact Now	Quick View China PCB Printed Circuit Board for SMT/EMS/OEM/ODM Multilayer HDI PCB Design for Electronics Contact Now	Quick View PCB Manufacturer Mother Board PCB Factory Double Sided/2layer Fr4 PCB Circuit Board Fabricator Contact Now	Quick View Wholesale Rigid PCB Board, Multilayer Printed Circuit Board with Gold Finger for Electronics Used Contact Now
Price	US $ 1.00-10.00/ Square Meter	Negotiable	US $ 0.01-50.00/ Piece	US $ 0.01-100.00/ Piece	US $ 0.01-50.00/ Piece
Min Order	1 Square Meters	50 Square Meters	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T	L/C, T/T, D/P, Western Union, Paypal, Money Gram, 30 days net	L/C, T/T, D/P, Western Union, Paypal, Money Gram, 30 days net	L/C, T/T, D/P, Western Union, Paypal, Money Gram, 30 days net
Quality Control
Product Certification	UL#ISO9001#ISO45001#IATF16949	-	-	-	-
Management System Certification	ISO 9001, ISO 14001, OHSAS/ OHSMS 18001, IATF16949, HSE, GMP, BRC, QHSE, ISO 13485, BREEAM, SHE Audits, FSC, ISO 17025	-	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	> US $100 Million	-	-	-
Business Model	OEM, ODM, Own Brand	Own Brand	OEM	OEM	OEM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Nelco Arlon Isola; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Zinpon Electronics; Surface Treatment: Enig2u'; Soldermask: Customized; Customization: Available;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: PTFE; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Delay Pressure Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Metal Composite Materials; Size: Customization; Tensile Strength: Excellent;	Structure: Flush Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Semi-Additive Process; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Abis; Layer: 1-40 Layers; Raw Material: Fr-4,Cu Base,High Tg Fr-4,PTFE,Rogers,Teflon etc.; Board Thickness: 0.20mm-8.00mm; Board Outline Tolerance: +0.10mm; Impedance Control Tolerance: +/-10%; Minimum Line/Space: 0.075mm; Surface Finish/Treatment: HASL,Enig,Chem,Tin,Flash Gold, OSP, Gold Finger;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Aerospace; Flame Retardant Properties: V2; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Abis; Layer Counts: 1-30 Layers; Board Thickness: 0.20mm-8.00mm; Maximum Size: 600mmx1200mm; Insulation Layer Thickness: 0.075mm--5.00mm; Minimum Line: 0.075mm; Minimum Space: 0.075mm; out Layer Copper Thickness: 18um--350um; Inner Layer Copper Thickness: 17um--175um; Diameter Tolerance(Mechanical): 0.05mm;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Semi-Additive Process; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Abis; Layer: 1-40 Layers; Raw Material: Fr-4,Cu Base,High Tg Fr-4,PTFE,Rogers,Teflon etc.; Board Thickness: 0.20mm-8.00mm; Board Outline Tolerance: +0.10mm; Impedance Control Tolerance: +/-10%; Surface Finish/Treatment: HASL,Enig,Chem,Tin,Flash Gold, OSP, Gold Finger;
Supplier Name	Shenzhen Zinpon Electronics Co, Ltd	Shandong Senrong New Materials Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.
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