Circuit Board Fast Protoype, Immersion Gold PCB, Electronics PCB Manufacturing PCB Assembly

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.10 / Piece

Sepcifications

  • Structure Multilayer Rigid PCB
  • Dielectric FR-4
  • Material Phenolic Paper Laminate
  • Application Aerospace
  • Flame Retardant Properties V0
  • Processing Technology Delay Pressure Foil
  • Production Process Semi-Additive Process
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Zitrok
  • Transport Package Vacuum Packing, Foam Protection, Carton Packing
  • Specification Blind & Buried Vias/Resin Plugged Vias/Gold Finger
  • Trademark Zitrok
  • Origin China
  • Quality Assurance UL, Aoi, RoHS, ISO9001, 100% E-Test
  • Material Stock Fr4, Isola, Rogers, Ceramic, Arlon, Pi, Taconic
  • MOQ 1PCS Is Okay

Product Description

About Zitrok With over 14 years developing, Zitrok offers one-stop shop services: Item: Circuit board fast protoype, Immersion gold pcb, electronics pcb manufacturing pcb assembly Quick-turn pcb service provided. Layer Samples Prototype Quick-turn Volume 2 5 WD 24 Hours - 48 ...

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PCB Assembly Comparison
Transaction Info
Price US $ 0.1/ Piece US $ 3.80-9.20/ Piece US $ 1.15-7.20/ Piece US $ 1.82-7.36/ Piece US $ 1.27-6.28/ Piece
Min Order 1 Pieces 100 Pieces 100 Pieces 100 Pieces 100 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal
Quality Control
Management System Certification ISO 9001 ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE
Trade Capacity
Export Markets North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, Europe, Southeast Asia/ Mideast North America, Europe, Southeast Asia/ Mideast North America, Europe, Southeast Asia/ Mideast North America, Europe, Southeast Asia/ Mideast
Annual Export Revenue - - - - -
Business Model OEM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Phenolic Paper Laminate;
Application: Aerospace;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Zitrok;
Quality Assurance: UL, Aoi, RoHS, ISO9001, 100% E-Test;
Material Stock: Fr4, Isola, Rogers, Ceramic, Arlon, Pi, Taconic;
MOQ: 1PCS Is Okay;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Indutrial Main Board;
Flame Retardant Properties: V0;
Processing Technology: Enig;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Layer Count: up to 64;
Cu Thickness: up to 12oz;
Board Thickness: up to 8mm;
Inner Core Material: 0.1mm;
Surface Finish: Immersiong Gold;
Conterbore Hole: 6.8mm / Depth 3.2mm;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Telecommunication;
Flame Retardant Properties: V0;
Processing Technology: Enig;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Layer Count: up to 64;
Cu Thickness: up to 12oz;
Board Thickness: up to 8mm;
Inner Core Material: 0.1mm Tg180;
Surface Finish: Immersiong Gold;
Other: Impedance Control;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Enig;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: 1;
Layer Count: up to 64;
Cu Thickness: up to 12oz;
Board Thickness: up to 8mm;
Min. Hole to Line: 8mil;
Counterbore Hole: 8.2mm/Depth 2.0mm;
Pressure Holes: 1.0mm;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Enig;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: 1;
Layer Count: up to 64;
Cu Thickness: up to 12oz;
Board Thickness: up to 8mm;
Min. Hole to Line: 8mil;
Surface Finish: Immersiong Gold;
Other: Impedance Control 3mil;
Supplier Name

Zitrok Electronics Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier