Electronics Printed Circuit Board Component SMT DIP SMD PCB Assembly

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.10 / Piece

Sepcifications

  • Type Combining Rigid Circuit Board
  • Dielectric FR-4
  • Material Paper Phenolic Copper Foil Substrate
  • Application Communication
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Aluminum
  • Insulation Materials Metal Composite Materials
  • Brand Zitrok
  • Transport Package Vacuum Packing, Foam Protection, Carton Packing
  • Specification Blind & Buried Vias/Resin Plugged Vias/Gold Finger
  • Trademark Zitrok
  • Origin China
  • Soldermask Color Red, Blue, Purple, Green, Black, White

Product Description

About Zitrok With over 14 years developing, Zitrok offers one-stop shop services: Item: Electronics Printed Circuit Board Component SMT DIP SMD PCB Assembly Quality Assurance: UL, AOI Inspection, ROHS,100% visual Inspection,IS09001,100% E-test. Quick-turn pcb service provided. Layer ...

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PCB Assembly Comparison
Transaction Info
Price US $ 0.1/ Piece US $ 0.80-8.00/ Piece US $ 0.1/ PCS US $ 1/ PCS US $ 0.80-1.00/ Piece
Min Order 1 Pieces 10 Pieces 1 PCS 1 PCS 1 Pieces
Trade Terms - - FOB, DAT, DDP, DAP, CIP, CPT, EXW FOB, DAT, DDP, DAP, CIP, CPT, EXW FOB, DDP, DAP
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T L/C, T/T, D/P, Paypal L/C, T/T, D/P, Paypal L/C, T/T, D/P
Quality Control
Product Certification - RoHS, CCC, ISO - - -
Management System Certification ISO 9001 ISO 9001, IATF16949, ISO 13485 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949
Trade Capacity
Export Markets North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia Domestic North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe
Annual Export Revenue - - - - -
Business Model OEM OEM, ODM OEM OEM OEM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: 1 Month(s)
Peak-season: 1-3 Month(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Brand: Zitrok;
Soldermask Color: Red, Blue, Purple, Green, Black, White;
Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Customized;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: OEM/ODM;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Type: Rigid Circuit Board;
Dielectric: AIN;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Uc;
Surface Finihsing: HASL-Lf;
Board Layer: 2 Layers;
Lead Time: 6 Working Days;
Type: Rigid Circuit Board;
Dielectric: AIN;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Board Layer: 4 Layers;
Finished Copper: All 1 Oz;
Board Thickness: 1.6mm;
Thickness Material: Aluminum;
Surface Finish: Enig 2u";
Soldermask Color: Green;
PCB Testing: E-Testing, Flying Probe Testing;
Ipc Standards: Ipc Class II;
Lead Time: 6 Working Days;
Fast Turn: 2 Working Days;
Type: Rigid Circuit Board;
Dielectric: Rogers;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Layer: 4 Layers;
Thickness: 1.62mm;
Mmodel: Xceh;
Rogers: R04003;
Supplier Name

Zitrok Electronics Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

China Supplier - Diamond Member Audited Supplier