PCB Assembly

US$0.10 / Piece

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High-Density Multilayer PCB, PCB Prototype and Series-Run Production, EMS Turnkey PCB Assembly pictures & photos

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What is High-Density Multilayer PCB, PCB Prototype and Series-Run Production, EMS Turnkey PCB Assembly

Name: High-Density Multilayer PCB, PCB Prototype and Series-Run Production, EMS Turnkey PCB Assembly
Uploaded: 2023-12-29T14:42:40+08:00
Description: About Zitrok With over 14 years developing, Zitrok offers one-stop shop services: Item: High-density multilayer PCB, PCB Prototype and series-run production, ems turnkey PCB assembly Quality Assuranc

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$0.10 / Piece

Sepcifications

Type Combining Rigid Circuit Board
Dielectric FR-4
Material Paper Phenolic Copper Foil Substrate
Application Communication
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Aluminum
Insulation Materials Metal Composite Materials
Brand Zitrok
Transport Package Vacuum Packing, Foam Protection, Carton Packing
Specification Blind & Buried Vias/Resin Plugged Vias/Gold Finger
Trademark Zitrok
Origin China
Soldermask Color Red, Blue, Purple, Green, Black, White

Product Description

About Zitrok With over 14 years developing, Zitrok offers one-stop shop services: Item: High-density multilayer PCB, PCB Prototype and series-run production, ems turnkey PCB assembly Quality Assurance: UL, AOI Inspection, ROHS,100% visual Inspection,IS09001,100% E-test. Quick-turn pcb ...

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Zitrok Electronics Co., Ltd.

Diamond Member Since 2023

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products PCB, PCBA, Circuit Board
Number of Employees 30
Year of Establishment 2012-02-21
Management System Certification ISO9001:2015
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

PCB Assembly Comparison

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Transaction Info
	Quick View High-Density Multilayer PCB, PCB Prototype and Series-Run Production, EMS Turnkey PCB Assembly Contact Now	Quick View Custom Medical PCBA One Stop Service PCB Circuit Boards SMT PCB Manufacturing and PCB Assembly Factory Contact Now	Quick View High Tg Plate PCBA Bespoke Components for Smart Electronics Contact Now	Quick View Fr-4 PCBA Supplier Customize Multilayers Circuit Board PCBA Fabrication and Assembly Service Contact Now	Quick View Rigid-Flex PCB PCBA Manufacturing and PCB Assembly Services Contact Now
Price	US $ 0.1/ Piece	US $ 0.67-5.00/ Piece	US $ 0.76-5.00/ Piece	US $ 0.65-6.00/ Piece	US $ 0.20-20.00/ Piece
Min Order	1 Pieces	10 Pieces	10 Pieces	10 Pieces	10 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, Money Gram	T/T, D/P, Paypal, Money Gram	T/T	T/T	T/T, D/P, Paypal, Money Gram
Quality Control
Product Certification	-	RoHS, CCC, ISO	RoHS, CCC, ISO	RoHS, CCC, ISO	RoHS, CCC, ISO
Management System Certification	ISO 9001	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485
Trade Capacity
Export Markets	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia	Domestic	Domestic	Domestic	Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	OEM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)
Product Attributes
Specification	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Paper Phenolic Copper Foil Substrate; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Metal Composite Materials; Brand: Zitrok; Soldermask Color: Red, Blue, Purple, Green, Black, White;	Type: Customized; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Customized; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Customized; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Customized; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Customized; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Customized; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Customized; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Customized; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;
Supplier Name	Zitrok Electronics Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.
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