PCB Assembly

US$0.10 / Piece

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What is Multilayer PCB Immerson Gold PCB Gold Plating, HDI Ceramic EMS PCB Board Manufacturing

Name: Multilayer PCB Immerson Gold PCB Gold Plating, HDI Ceramic EMS PCB Board Manufacturing
Uploaded: 2023-12-02T12:03:58+08:00
Description: About Zitrok With over 14 years developing, Zitrok offers one-stop shop services: Item: Multilayer PCB Immerson gold PCB Gold Plating, HDI Ceramic EMS PCB Board Manufacturing Quality Assurance: UL, A

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$0.10 / Piece

Sepcifications

Type Combining Rigid Circuit Board
Dielectric FR-4
Material Paper Phenolic Copper Foil Substrate
Application Communication
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Aluminum
Insulation Materials Metal Composite Materials
Brand Zitrok
Transport Package Vacuum Packing, Foam Protection, Carton Packing
Specification Blind & Buried Vias/Resin Plugged Vias/Gold Finger
Trademark Zitrok
Origin China
Soldermask Color Red, Blue, Purple, Green, Black, White

Product Description

About Zitrok With over 14 years developing, Zitrok offers one-stop shop services: Item: Multilayer PCB Immerson gold PCB Gold Plating, HDI Ceramic EMS PCB Board Manufacturing Quality Assurance: UL, AOI Inspection, ROHS,100% visual Inspection,IS09001,100% E-test. Quick-turn pcb service ...

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Zitrok Electronics Co., Ltd.

Diamond Member Since 2023

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products PCB, PCBA, Circuit Board
Number of Employees 30
Year of Establishment 2012-02-21
Management System Certification ISO9001:2015
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

PCB Assembly Comparison

	Quick View Multilayer PCB Immerson Gold PCB Gold Plating, HDI Ceramic EMS PCB Board Manufacturing Contact Now	High Tg HDI Blind Buried BGA Control Impedance PCB Contact Now	Multi-Layer PCB with Lead-Free HASL and High Tg Laminate Contact Now	Quick View 2018 Latest Lead Free HASL PCB for Consumer Electronics Contact Now	Quick View Multilayer HDI PCB, , BGA PCB, Impedance PCB Contact Now

Transaction Info
	Quick View Multilayer PCB Immerson Gold PCB Gold Plating, HDI Ceramic EMS PCB Board Manufacturing Contact Now	High Tg HDI Blind Buried BGA Control Impedance PCB Contact Now	Multi-Layer PCB with Lead-Free HASL and High Tg Laminate Contact Now	Quick View 2018 Latest Lead Free HASL PCB for Consumer Electronics Contact Now	Quick View Multilayer HDI PCB, , BGA PCB, Impedance PCB Contact Now
Price	US $ 0.1/ Piece	US $ 10.5/ Piece	US $ 5.5/ Piece	US $ 1.50-4.00/ Piece	US $ 8.50-10.00/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal
Quality Control
Management System Certification	ISO 9001	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia	North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM	OEM, Own Brand	OEM, Own Brand	OEM, Own Brand	OEM, Own Brand
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Paper Phenolic Copper Foil Substrate; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Metal Composite Materials; Brand: Zitrok; Soldermask Color: Red, Blue, Purple, Green, Black, White;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: HASL Lead-Free; Base Material: Copper; Insulation Materials: Epoxy Resin; Material Type: Fr4,High Tg,Cem1,Cem3,Aluminiaum Base,Arlon,Roger; Layer Counts: 1--30; Board Thickness: 0.2mm--6.0mm; Fished Outer Copper: 1oz--5oz; Minimum Trace Width: 0.003''; Surface Treatment Type: HASL;HASL+Lead Free;Immersion Gold; Immersion Tin;;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Immersion. Gold; Base Material: Copper; Insulation Materials: Epoxy Resin; Material Type: Fr4,High Tg,Cem1,Cem3,Aluminiaum Base,Arlon,Roger; Layer Counts: 1--30; Board Thickness: 0.2mm--6.0mm; Fished Outer Copper: 1oz--5oz; Minimum Trace Width: 0.003''; Surface Treatment Type: HASL;HASL+Lead Free;Immersion Gold; Immersion Tin;;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Immersion. Gold; Base Material: Copper; Insulation Materials: Epoxy Resin; Material Type: Fr4,High Tg,Cem1,Cem3,Aluminiaum Base,Arlon,Roger; Layer Counts: 1--30; Board Thickness: 0.2mm--6.0mm; Fished Outer Copper: 1oz--5oz; Minimum Trace Width: 0.003''; Surface Treatment Type: HASL;HASL+Lead Free;Immersion Gold; Immersion Tin;;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: HASL Lead-Free; Base Material: Fr4; Insulation Materials: Epoxy Resin; Brand: Not Specified; Material Type: Fr4, Cem1, Cem3, Aluminiaum Base, Arlon, Roger; Layer Counts: 1--30; Board Thickness: 0.2mm--6.0mm; Fished Outer Copper: 1oz--5oz; Minimum Trace Width: 3mil/4mil; Surface Treatment Type: HASL;HASL+Lead Free;Immersion Gold; Immersion Tin;;
Supplier Name	Zitrok Electronics Co., Ltd.	Keep Moving Circuits Co., Ltd.	Keep Moving Circuits Co., Ltd.	Keep Moving Circuits Co., Ltd.	Keep Moving Circuits Co., Ltd.
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