Quick Turn Immersion Gold with BGA, Resin Plugged Vias Impedance Control EMS PCB Board/PCBA pictures & photos

Quick Turn Immersion Gold with BGA, Resin Plugged Vias Impedance Control EMS PCB Board/PCBA

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$0.10 / Piece

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Phenolic Paper Laminate
Application Medical Instruments
Flame Retardant Properties V0
Processing Technology Delay Pressure Foil
Production Process Semi-Additive Process
Base Material Copper
Insulation Materials Epoxy Resin
Brand Zitrok
Transport Package Vacuum Packing, Foam Protection, Carton Packing
Specification Blind & Buried Vias/Resin Plugged Vias/Gold Finger
Trademark Zitrok
Origin China

Product Description

About Zitrok With over 14 years developing, Zitrok offers one-stop shop services: Item: Quick Turn Immersion Gold with BGA, Resin Plugged Vias Impedance Control EMS PCB Board/PCBA Quality Assurance: UL, AOI Inspection, ROHS,100% visual Inspection,IS09001,100% E-test. Quick-turn pcb service ...

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Zitrok Electronics Co., Ltd.

Diamond Member Since 2023

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products PCB, PCBA, Circuit Board
Number of Employees 30
Year of Establishment 2012-02-21
Management System Certification ISO9001:2015
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

PCB Assembly Comparison

	Quick Turn Immersion Gold with BGA, Resin Plugged Vias Impedance Control EMS PCB Board/PCBA Contact Now	HDI Multilayer Fr4 Material Circuit Board Contact Now	Flash Light PCB/LED PCB Board Contact Now	Flash Light FPC Board Manufacture Contact Now	Quick View Mobile Charger Printed Circuit Board Contact Now

Transaction Info
	Quick Turn Immersion Gold with BGA, Resin Plugged Vias Impedance Control EMS PCB Board/PCBA Contact Now	HDI Multilayer Fr4 Material Circuit Board Contact Now	Flash Light PCB/LED PCB Board Contact Now	Flash Light FPC Board Manufacture Contact Now	Quick View Mobile Charger Printed Circuit Board Contact Now
Price	US $ 0.1/ Piece	US $ 0.20-0.30/ Piece	US $ 0.10-1.00/ Piece	US $ 0.1/ Piece	US $ 0.1/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	FOB, CFR, EXW, CIF, DAT, FAS, DDP, DAP, CIP, CPT, FCA	FOB, CFR, EXW, CIF, FAS, DDP, DAP, CIP, CPT, FCA	FOB, CFR, CIF, DAT, FAS, DDP, DAP, CIP, CPT, FCA, EXW	FOB, CFR, CIF, DAT, FAS, DDP, DAP, CIP, CPT, FCA, EXW
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, Western Union, Paypal, Money Gram, cash	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification	-	RoHS, UL, SGS, Ect	-	RoHS, UL, SGS, Ect	RoHS, UL, SGS, Ect
Management System Certification	ISO 9001	ISO 9001, ISO 14001	ISO 9001, ISO 14001	ISO 9001, ISO 14001	ISO 9001, ISO 14001
Trade Capacity
Export Markets	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Phenolic Paper Laminate; Application: Medical Instruments; Flame Retardant Properties: V0; Processing Technology: Delay Pressure Foil; Production Process: Semi-Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Zitrok;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Fr4; Insulation Materials: Organic Resin; Surface Finishing: HASL; Copper Thickness: 1oz; Board Thickness: 1.6mm; Min. Hole Size: 0.1mm; Min. Line Wigth: 0.075mm; Min. Line Spacing: 0.075mm; Color: Blue; Size: 103mm58mm;* Package: Vacuum;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Base Material: Fr4; Insulation Materials: Organic Resin; Board Size: Customized; Board Color: Green/Black/Red/Yellow Customized; Silkscreen Color: Green/Black/Red/Yellow Customized; Design Improvement: Available; Min. Line Space: 4mil; Min.Hole Size: 0.2mm; Min.Line Width: 4mil; Certificates: ISO, UL, SGS, RoHS; Shipping Express: DHL, UPS, TNT, Aramex, FedEx; Surface Finishing: Immersion Gold;	Structure: Metal Base Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Finishing: OSP; Copper Thickness: 1oz; Board Thickness: 1.6mm; Min. Hole Size: 0.25mm; Min. Line Wigth: 0.15mm; Min. Line Spacing: 0.15mm; Color: Blue; Size: 6656mm;* Package: Vacuum;	Structure: Metal Base Rigid PCB; Dielectric: Pi; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Finishing: OSP; Copper Thickness: 1oz; Board Thickness: 1.6mm; Min. Hole Size: 0.25mm; Min. Line Wigth: 0.15mm; Min. Line Spacing: 0.15mm; Color: Blue; Size: 6656mm;* Package: Vacuum;
Supplier Name	Zitrok Electronics Co., Ltd.	Shenzhen Xinjiaye Electronics Technology Co., Ltd.	Shenzhen Xinjiaye Electronics Technology Co., Ltd.	Shenzhen Xinjiaye Electronics Technology Co., Ltd.	Shenzhen Xinjiaye Electronics Technology Co., Ltd.
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