Immersion Gold 1-10u′′ Enig PCB, Heavy Copper PCB Board, Electronics Circuit Board

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.10 / Piece

Sepcifications

  • Structure Multilayer Rigid PCB
  • Dielectric FR-4
  • Material Phenolic Paper Laminate
  • Application Aerospace
  • Flame Retardant Properties V0
  • Processing Technology Delay Pressure Foil
  • Production Process Semi-Additive Process
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Zitrok
  • Transport Package Vacuum Packing, Foam Protection, Carton Packing
  • Specification Blind & Buried Vias/Resin Plugged Vias/Gold Finger
  • Trademark Zitrok
  • Origin China
  • Quality Assurance UL, Aoi, RoHS, ISO9001, 100% E-Test
  • Material Stock Fr4, Isola, Rogers, Ceramic, Arlon, Pi, Taconic
  • MOQ 1PCS Is Okay

Product Description

About Zitrok With over 14 years developing, Zitrok offers one-stop shop services: Item: Immersion gold 1-10u'' ENIG PCB, Heavy Copper PCB Board, Electronics Circuit Board Quick-turn pcb service provided. Layer Samples Prototype Quick-turn Volume 2 5 WD 24 Hours - 48 Hours 8 - 10 ...

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PCB Assembly Comparison
Transaction Info
Price US $ 0.1/ Piece US $ 0.32-0.43/ piece US $ 0.32-0.45/ piece US $ 0.33-0.46/ piece US $ 0.12-6.65/ Piece
Min Order 1 Pieces 1 piece 1 piece 1 piece 1 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, Western Union, Paypal L/C, T/T, Western Union, Paypal L/C, T/T, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal
Quality Control
Management System Certification ISO 9001 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Phenolic Paper Laminate;
Application: Aerospace;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Zitrok;
Quality Assurance: UL, Aoi, RoHS, ISO9001, 100% E-Test;
Material Stock: Fr4, Isola, Rogers, Ceramic, Arlon, Pi, Taconic;
MOQ: 1PCS Is Okay;
Structure: Double-Sided Rigid PCB;
Dielectric: FR-3;
Material: Phenolic Paper Laminate;
Application: Computer;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Brand: Fastline;
Board Material: Fr4;
Layers: 1 to 30 Layers;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Solder Mask: Green;
Silk Screen: White;
Surface Treatment: HASL Lead Free;
Test: 100%;
Lead Time: 6-8 Working Days;
Min. Line Width: 0.075mm;
Structure: Double-Sided Rigid PCB;
Dielectric: FR-3;
Material: Phenolic Paper Laminate;
Application: Computer;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Brand: Fastline;
Board Material: Fr4;
Layers: 1 to 30 Layers;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Solder Mask: Green;
Silk Screen: White;
Surface Treatment: HASL Lead Free;
Test: 100%;
Lead Time: 6-8 Working Days;
Min. Line Width: 0.075mm;
Structure: Double-Sided Rigid PCB;
Dielectric: FR-3;
Material: Phenolic Paper Laminate;
Application: Computer;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Brand: Fastline;
Board Material: Fr4;
Layers: 1 to 30 Layers;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Solder Mask: Green;
Silk Screen: White;
Surface Treatment: HASL Lead Free;
Test: 100%;
Lead Time: 6-8 Working Days;
Min. Line Width: 0.075mm;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: FL;
Soldermask: Red;
Silkscreen: Black;
Materials: Fr4;
Surface: Enig;
MOQ: 1PCS;
Service: Fast Deliver;
Board Thickness: 3.2;
Copper Thickness: 2oz;
Mini Holes: 0.1mm;
Mini Track: 3mil/3mil;
Test: 100%;
Small Order: Accept;
Lead Time: 5-6days;
Package: Carton;
Delivery: DHL/FedEx/UPS;
Supplier Name

Zitrok Electronics Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Fastline Circuits Co., Limited

China Supplier - Gold Member Audited Supplier

Fastline Circuits Co., Limited

China Supplier - Gold Member Audited Supplier

Fastline Circuits Co., Limited

China Supplier - Gold Member Audited Supplier

Fastline Circuits Co., Limited

China Supplier - Gold Member Audited Supplier