Printed Circuit Board HDI PCB for Long Size 1650mm PCB Board

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.10 / Piece

Sepcifications

  • Structure Flush Rigid PCB
  • Dielectric FR-4
  • Material Epoxy Paper Laminate
  • Application Communication
  • Flame Retardant Properties V0
  • Processing Technology Delay Pressure Foil
  • Production Process Additive Process
  • Base Material Aluminum
  • Insulation Materials Epoxy Resin
  • Brand Zitrok
  • Transport Package Vacuum Packing, Foam Protection, Carton Packing
  • Specification Blind & Buried Vias/Resin Plugged Vias/Gold Finger
  • Trademark Zitrok
  • Origin China
  • Soldermask Color Red, Blue, Purple, Green, Black, White

Product Description

About Zitrok With over 14 years developing, Zitrok offers one-stop shop services: Item: Printed circuit board HDI PCB for Long Size 1650mm PCB Board Quality Assurance: UL, AOI Inspection, ROHS,100% visual Inspection,IS09001,100% E-test. Quick-turn pcb service provided. Layer Samples ...

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PCB Assembly Comparison
Transaction Info
Price US $ 0.1/ Piece US $ 0.95-2.10/ Piece US $ 0.95-2.10/ Piece US $ 0.95-2.10/ Piece US $ 0.95-2.10/ Piece
Min Order 1 Pieces 100 Pieces 100 Pieces 100 Pieces 100 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal, WeChat/Alipay
Quality Control
Product Certification - ISO9001, ISO16949, RoHS ISO9001, ISO16949, RoHS ISO9001, ISO16949, RoHS ISO9001, ISO16949, RoHS
Management System Certification ISO 9001 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Structure: Flush Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Production Process: Additive Process;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Zitrok;
Soldermask Color: Red, Blue, Purple, Green, Black, White;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Surface Treatment: OSP, Immersion Gold, Immersion Tin, Immersion AG;
Impedance Control Accuracy: ±8%;
Minimum Solder Resist Opening: 1.5mil;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Surface Treatment: OSP, Immersion Gold, Immersion Tin, Immersion AG;
Impedance Control Accuracy: ±8%;
Minimum Solder Resist Opening: 1.5mil;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Surface Treatment: OSP, Immersion Gold, Immersion Tin, Immersion AG;
Impedance Control Accuracy: ±8%;
Minimum Solder Resist Opening: 1.5mil;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Surface Treatment: OSP, Immersion Gold, Immersion Tin, Immersion AG;
Impedance Control Accuracy: ±8%;
Minimum Solder Resist Opening: 1.5mil;
Supplier Name

Zitrok Electronics Co., Ltd.

China Supplier - Diamond Member Audited Supplier

King Field Electronic Co., Ltd. (Shenzhen)

China Supplier - Diamond Member Audited Supplier

King Field Electronic Co., Ltd. (Shenzhen)

China Supplier - Diamond Member Audited Supplier

King Field Electronic Co., Ltd. (Shenzhen)

China Supplier - Diamond Member Audited Supplier

King Field Electronic Co., Ltd. (Shenzhen)

China Supplier - Diamond Member Audited Supplier