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Immersion Gold 9oz Heavy Copper with High Tg170 PCB Circuit Board Electronics Manufacturing & Assembly Mother Board pictures & photos

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What is Immersion Gold 9oz Heavy Copper with High Tg170 PCB Circuit Board Electronics Manufacturing & Assembly Mother Board

Name: Immersion Gold 9oz Heavy Copper with High Tg170 PCB Circuit Board Electronics Manufacturing & Assembly Mother Board
Uploaded: 2024-02-22T11:46:18+08:00
Description: About Zitrok With over 14 years developing, Zitrok offers one-stop shop services: Item: Immersion Gold 9oz Heavy Copper with High Tg170 PCB Circuit Board Electronics Manufacturing & Assembly Mother B

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$0.10 / Piece

Sepcifications

Type Combining Rigid Circuit Board
Dielectric FR-4
Material Complex
Application Aerospace
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Delay Pressure Foil
Base Material Copper
Insulation Materials Epoxy Resin
Brand Zitrok
Transport Package Vacuum Packing, Foam Protection, Carton Packing
Specification Blind & Buried Vias/Resin Plugged Vias/Gold Finger
Trademark Zitrok
Origin China
Quality Assurance UL, Aoi, RoHS, ISO9001, 100% E-Test
Material Stock Fr4, Isola, Rogers, Ceramic, Arlon, Pi, Taconic
MOQ 1PCS Is Okay

Product Description

About Zitrok With over 14 years developing, Zitrok offers one-stop shop services: Item: Immersion Gold 9oz Heavy Copper with High Tg170 PCB Circuit Board Electronics Manufacturing &Assembly Mother Board Quick-turn pcb service provided. Layer Samples Prototype Quick-turn Volume 2 ...

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Zitrok Electronics Co., Ltd.

Diamond Member Since 2023

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products PCB, PCBA, Circuit Board
Number of Employees 30
Year of Establishment 2012-02-21
Management System Certification ISO9001:2015
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

PCB Assembly Comparison

	Quick View Immersion Gold 9oz Heavy Copper with High Tg170 PCB Circuit Board Electronics Manufacturing & Assembly Mother Board Contact Now	Quick View Printed Circuit Board Industry in China Contact Now	Quick View High Tg Multilayer PCB Immersion Gold 94V0 Print Circuit Board Contact Now	Quick View Custom Design Multilayer Printed Board Circuit Contact Now	Quick View Multi Layers Electronics PCB Printed Circuits Board Made of Fr4 Tg150 with 2 U" Enig in Blue Ink Contact Now

Transaction Info
	Quick View Immersion Gold 9oz Heavy Copper with High Tg170 PCB Circuit Board Electronics Manufacturing & Assembly Mother Board Contact Now	Quick View Printed Circuit Board Industry in China Contact Now	Quick View High Tg Multilayer PCB Immersion Gold 94V0 Print Circuit Board Contact Now	Quick View Custom Design Multilayer Printed Board Circuit Contact Now	Quick View Multi Layers Electronics PCB Printed Circuits Board Made of Fr4 Tg150 with 2 U" Enig in Blue Ink Contact Now
Price	US $ 0.1/ Piece	US $ 0.10-80.00/ Piece	US $ 0.10-80.00/ Piece	US $ 0.10-80.00/ Piece	US $ 0.01-100.00/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, D/P, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal, Money Gram, 30 days net
Quality Control
Product Certification	-	UL, ISO9001&ISO14001, SGS, RoHS Report	UL,ISO9001&ISO14001,SGS,RoHS Report	UL, ISO9001&ISO14001, SGS, RoHS Report	-
Management System Certification	ISO 9001	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM	OEM	OEM	OEM	OEM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Complex; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Delay Pressure Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Zitrok; Quality Assurance: UL, Aoi, RoHS, ISO9001, 100% E-Test; Material Stock: Fr4, Isola, Rogers, Ceramic, Arlon, Pi, Taconic; MOQ: 1PCS Is Okay;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Kb; Insulation Materials: Epoxy Resin; Brand: Abis; Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole; Board Thickness: 0.2-8mm; Copper Thickness: 0.5-10oz; Layers: 1-32layers; Enig Thickness: 1-3u''; Hard Gold Thickness: 5-50u'';	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Kb; Insulation Materials: Epoxy Resin; Brand: Abis; Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole; Board Thickness: 0.2-6mm; Copper Thickness: 0.5-8oz; Layers: 1-20layers;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Kb; Insulation Materials: Epoxy Resin; Brand: Abis; Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole; Board Thickness: 0.2-8mm; Copper Thickness: 0.5-10oz; Layers: 1-32layers; Enig Thickness: 1-3u''; Hard Gold Thickness: 5-50u'';	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Abis; Layers: 6; Board Thickness: 1.6mm; Raw Material: Fr4 Tg150; Panel up: 1010;* Surface Finish: Immersion Gold; Legend: White; Inner Copper: 35um; Outer Copper: 70um;
Supplier Name	Zitrok Electronics Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.
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