| Specification |
Structure: Flush Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Production Process: Additive Process;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Zitrok;
Soldermask Color: Red, Blue, Purple, Green, Black, White;
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Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Exceeding;
Delivery: 24hours~5 Days;
Service: 7*24 Hours Online;
Price: Factory Price;
Keyword: Custom PCB;
Product Name: Rigid PCB;
MOQ: 1 PCS;
Min. Hole Size: 0.1mm(4mil) for HDI / 0.15mm(6mil);
Min. Line Width: 0.075mm(3mil);
Copper Thickness: 0.5-12oz(18-420um);
Min. Line Spacing: 0.075mm(3mil);
Board Thickness: 0.2-6.0mm;
Surface Finishing: Immersion Silver, Tin, Gold /HASL Lead Free;
One-Stop Service: PCB Assembly, Component Supply;
Testing Service: 100% E-Testing;
|
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Exceeding;
Delivery: 24hours~5 Days;
Service: 7*24 Hours Online;
Price: Factory Price;
Keyword: Custom PCB;
Product Name: Rigid PCB;
MOQ: 1 PCS;
Min. Hole Size: 0.1mm(4mil) for HDI / 0.15mm(6mil);
Min. Line Width: 0.075mm(3mil);
Copper Thickness: 0.5-12oz(18-420um);
Min. Line Spacing: 0.075mm(3mil);
Board Thickness: 0.2-6.0mm;
Surface Finishing: Immersion Silver, Tin, Gold /HASL Lead Free;
One-Stop Service: PCB Assembly, Component Supply;
Testing Service: 100% E-Testing;
|
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Exceeding;
Delivery: 24hours~5 Days;
Service: 7*24 Hours Online;
Price: Factory Price;
Keyword: Custom PCB;
Product Name: Rigid PCB;
MOQ: 1 PCS;
Min. Hole Size: 0.1mm(4mil) for HDI / 0.15mm(6mil);
Min. Line Width: 0.075mm(3mil);
Copper Thickness: 0.5-12oz(18-420um);
Min. Line Spacing: 0.075mm(3mil);
Board Thickness: 0.2-6.0mm;
Surface Finishing: Immersion Silver, Tin, Gold /HASL Lead Free;
One-Stop Service: PCB Assembly, Component Supply;
Testing Service: 100% E-Testing;
|
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Exceeding;
Delivery: 24hours~5 Days;
Service: 7*24 Hours Online;
Price: Factory Price;
Keyword: Custom PCB;
Product Name: Rigid PCB;
MOQ: 1 PCS;
Min. Hole Size: 0.1mm(4mil) for HDI / 0.15mm(6mil);
Min. Line Width: 0.075mm(3mil);
Copper Thickness: 0.5-12oz(18-420um);
Min. Line Spacing: 0.075mm(3mil);
Board Thickness: 0.2-6.0mm;
Surface Finishing: Immersion Silver, Tin, Gold /HASL Lead Free;
One-Stop Service: PCB Assembly, Component Supply;
Testing Service: 100% E-Testing;
|
