Basic Info.
Model NO.
ESP32-PICO-MINI-02/02U Datasheet
WiFi Antenna Type
Built-in
Transmission Rate
151-200Mbps
Certification
RoHS, FCC, CE
Product Description
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Espressif wifi chip price espressif pico ESP32-PICO-MINI-02/02U Datasheet
ESP32-PICO-MINI-02 ESP32-PICO-MINI-02U
Datasheet
2.4 GHz Wi-Fi + Bluetooth® + Bluetooth LE module
Built around ESP32 series of SoCs, Xtensa® dual-core 32-bit LX6 microprocessor Flash up to 8 MB, PSRAM up to 2 MB
27 GPIOs, rich set of peripherals
On-board PCB antenna or external antenna connector
1.1Features
CPU and On-Chip Memory
•ESP32-PICO-V3-02 embedded, Xtensa
dual-core 32-bit LX6 microprocessor, up to 240 MHz
•448 KB ROM for booting and core functions
•520 KB SRAM for data and instructions
•16 KB SRAM in RTC
•8 MB SPI flash
•2 MB PSRAM
Wi-Fi
•802.11b/g/n
•Bit rate: 802.11n up to 150 Mbps
•A-MPDU and A-MSDU aggregation
•0.4 µs guard interval support
•Center frequency range of operating channel: 2412 ~ 2484 MHz
Bluetooth
•Bluetooth V4.2 BR/EDR and Bluetooth LE specification
•Class-1, class-2 and class-3 transmitter
•AFH
•CVSD and SBC
Peripherals
•SD card, UART, SPI, SDIO, I2C, LED PWM, Motor PWM, I2S, IR, pulse counter, GPIO, capacitive touch sensor, ADC, DAC, Two-Wire Automotive Interface (TWAI®, compatible with ISO11898-1), Ethernet MAC
Integrated Components on Module
•40 MHz crystal oscillator
Antenna Options
•ESP32-PICO-MINI-02: On-board PCB antenna
•ESP32-PICO-MINI-02U: external antenna via a connector
Operating Conditions
•Operating voltage/Power supply: 3.0 ~ 3.6 V
•Operating ambient temperature: -40 ~ 85 °C
Certification
•RF certification: CE/FCC/SRRC
•Green certification: REACH/RoHS
Test
•Reliability: HTOL/HTSL/uHAST/TCT/ESD
1.2Description
ESP32-PICO-MINI-02 and ESP32-PICO-MINI-02U are two general-purpose Wi-Fi + Bluetooth + Bluetooth LE MCU modules. They are based on ESP32-PICO-V3-02, a System-in-Package (SiP) device, which integrates an 8
MB SPI flash, 2 MB SPI Pseudo static RAM (PSRAM) and 40 MHz crystal oscillator. The rich set of peripherals and a small size make the two modules an ideal choice for a wide variety of IoT applications, ranging from home automation, smart building, consumer electronics to industrial control, and they are suitable for intelligent speakers, speech recognition toys, intelligent gateway and Ethernet, etc.
ESP32-PICO-MINI-02 comes with a PCB antenna. ESP32-PICO-MINI-02U comes with a connector for an external antenna. The ordering information of the two modules is listed as follows:
Table 1: Ordering Information | Module | Ordering Code | Chip embedded | Module dimensions (mm) |
| ESP32-PICO-MINI-02 | ESP32-PICO-MINI-02-N8R2 | ESP32-PICO-V3-02 | 13.2 × 16.6 × 2.4 |
| ESP32-PICO-MINI-02U | ESP32-PICO-MINI-02U-N8R2 | ESP32-PICO-V3-02 | 13.2 × 11.2 × 2.4 |
1.3Applications
•Generic Low-power IoT Sensor Hub
•Generic Low-power IoT Data Loggers
•Cameras for Video Streaming
•Over-the-top (OTT) Devices
•Speech Recognition
•Image Recognition
•Mesh Network
•Home Automation
•
Smart Building
•Industrial Automation
•Smart Agriculture
•Audio Applications
•Health Care Applications
•Wi-Fi-enabled Toys
•Wearable Electronics
•Retail & Catering Applications3.2Pin Description
ESP32-PICO-MINI-02 and ESP32-PICO-MINI-02U each has 53 pins. See pin definitions in Table 2. For peripheral pin configurations, please refer to ESP32 Series Datasheet.
Table 2: Pin Definitions | Name | No. | Type1 | Function |
| GND | 1, 2, 11, 14, 36-53 | P | Ground |
| 3V3 | 3 | P | Power supply |
| I36 | 4 | I | GPIO36, ADC1_CH0, RTC_GPIO0 |
| I37 | 5 | I | GPIO37, ADC1_CH1, RTC_GPIO1 |
| I38 | 6 | I | GPIO38, ADC1_CH2, RTC_GPIO2 |
| I39 | 7 | I | GPIO39, ADC1_CH3, RTC_GPIO3 |
| EN | 8 | I | High: On; enables the chip Low: Off; the chip powers off
Note: Do not leave EN pin floating. |
| I34 | 9 | I | GPIO34, ADC1_CH6, RTC_GPIO4 |
| I35 | 10 | I | GPIO35, ADC1_CH7, RTC_GPIO5 |
| IO32 | 12 | I/O | GPIO32, XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4,
TOUCH9, RTC_GPIO9 |
| IO33 | 13 | I/O | GPIO33, XTAL_32K_N (32.768 kHz crystal oscillator output),
ADC1_CH5, TOUCH8, RTC_GPIO8 |
| IO25 | 15 | I/O | GPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0 |
| IO26 | 16 | I/O | GPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1 |
| Name | No. | Type1 | Function |
| IO27 | 17 | I/O | GPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DV |
| IO14 | 18 | I/O | GPIO14, ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK,
HS2_CLK, SD_CLK, EMAC_TXD2 |
| IO12 | 19 | I/O | GPIO12, ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ,
HS2_DATA2, SD_DATA2, EMAC_TXD3 |
| IO13 | 20 | I/O | GPIO13, ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID,
HS2_DATA3, SD_DATA3, EMAC_RX_ER |
| IO15 | 21 | I/O | GPIO15, ADC2_CH3, TOUCH3, RTC_GPIO13, MTDO, HSPICS0,
HS2_CMD, SD_CMD, EMAC_RXD3 |
| IO2 | 22 | I/O | GPIO2, ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0,
SD_DATA0 |
| IO0 | 23 | I/O | GPIO0, ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1,
EMAC_TX_CLK |
| IO4 | 24 | I/O | GPIO4, ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1,
SD_DATA1, EMAC_TX_ER |
| NC | 25 | - | - |
| IO20 | 26 | I/O | GPIO20 |
| IO7 | 27 | I/O | GPIO7, HS1_DATA0, U2RTS, SD_DATA0 |
| IO8 | 28 | I/O | GPIO8, HS1_DATA1, U2CTS, SD_DATA1 |
| IO5 | 29 | I/O | GPIO5, VSPICS0, HS1_DATA6, EMAC_RX_CLK |
| RXD0 | 30 | I/O | GPIO3, U0RXD, CLK_OUT2 |
| TXD0 | 31 | I/O | GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2 |
| NC | 32 | - | - |
| IO19 | 33 | I/O | GPIO19, VSPIQ, U0CTS, EMAC_TXD0 |
| IO22 | 34 | I/O | GPIO22, VSPIWP, U0RTS, EMAC_TXD1 |
| IO21 | 35 | I/O | GPIO21, VSPIHD, EMAC_TX_EN |
* Pins CMD/IO11 and CLK/IO6 are used for connecting the embedded flash, and pins SD2/IO9 and SD3/IO10 are used for connecting embedded PSRAM. These pins are not led out.
3.3Strapping Pins
ESP32-PICO-V3-02 has five strapping pins:
•MTDI
•GPIO0
•GPIO2
•MTDO
•GPIO5
Software can read the values of these five bits from register "GPIO_STRAPPING".
During the chip's system reset release (power-on-reset, RTC watchdog reset and brownout reset), the latches of the strapping pins sample the voltage level as strapping bits of "0" or "1", and hold these bits until the chip is powered down or shut down. The strapping bits configure the device's boot mode, the operating voltage of VDD_SDIO and other initial system settings.
Each strapping pin is connected to its internal pull-up/pull-down during the chip reset. Consequently, if a strapping pin is unconnected or the connected external circuit is high-impedance, the internal weak
pull-up/pull-down will determine the default input level of the strapping pins.
To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or use the host MCU's GPIOs to control the voltage level of these pins when powering on ESP32-PICO-V3-02.
After reset release, the strapping pins work as normal-function pins. Refer to Table 3 for a detailed boot-mode configuration by strapping pins.
Table 3: Strapping Pins | Voltage of Internal LDO (VDD_SDIO) |
| Pin | Default | 3.3 V | 1.8 V |
| MTDI | Pull-down | 0 | 1 |
| Booting Mode |
| Pin | Default | SPI Boot | Download Boot |
| GPIO0 | Pull-up | 1 | 0 |
| GPIO2 | Pull-down | Don't-care | 0 |
| Enabling/Disabling Debugging Log Print over U0TXD During Booting |
| Pin | Default | U0TXD Active | U0TXD Silent |
| MTDO | Pull-up | 1 | 0 |
| Timing of SDIO Slave |
| Pin | Default | FE Sampling
FE Output | FE Sampling
RE Output | RE Sampling
FE Output | RE Sampling
RE Output |
| MTDO | Pull-up | 0 | 0 | 1 | 1 |
| GPIO5 | Pull-up | 0 | 1 | 0 | 1 |
*Firmware can configure register bits to change the settings of "Voltage of Internal LDO (VDD_SDIO)" and "Timing of SDIO Slave", after booting.
*The module integrates a 3.3 V SPI flash, so the pin MTDI cannot be set to 1 when
the module is powered up.4Electrical Characteristics
4.1Absolute Maximum Ratings
Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Table 4: Absolute Maximum Ratings | Symbol | Parameter | Min | Max | Unit |
| VDD33 | Power supply voltage | -0.3 | 3.6 | V |
| TSTORE | Storage temperature | -40 | 85 | °C |
4.2Recommended Operating Conditions
Table 5: Recommended Operating Conditions
| Symbol | Parameter | Min | Typ | Max | Unit |
| VDD33 | Power supply voltage | 3.0 | 3.3 | 3.6 | V |
| IV DD | Current delivered by external power supply | 0.5 | - | - | A |
| T | Operating ambient temperature | -40 | - | 85 | °C |
| Humidity | Humidity condition | - | - | 85 | %RH |
4.3DC Characteristics (3.3 V, 25 °C)
Table 6: DC Characteristics (3.3 V, 25 °C)
| Symbol | Parameter | Min | Typ | Max | Unit |
| CIN | Pin capacitance | - | 2 | - | pF |
| VIH | High-level input voltage | 0.75 × VDD1 | - | VDD1+ 0.3 | V |
| VIL | Low-level input voltage | -0.3 | - | 0.25 × VDD1 | V |
| IIH | High-level input current | - | - | 50 | nA |
| IIL | Low-level input current | - | - | 50 | nA |
| VOH | High-level output voltage | 0.8 × VDD1 | - | - | V |
| VOL | Low-level output voltage | - | - | 0.1 × VDD1 | V |
| Symbol | Parameter | Min | Typ | Max | Unit |
| IOH | High-level source current (VDD1= 3.3 V,
VOH >= 2.64 V,
output drive strength set to the maximum) | VDD3P3_CPU
power domain 1, 2 | - | 40 | - | mA |
| | | VDD3P3_RTC
power domain 1, 2 | - | 40 | - | mA |
| | | VDD_SDIO power
domain 1, 3 | - | 20 | - | mA |
| IOL | Low-level sink current (VDD1= 3.3 V, VOL = 0.495 V,
output drive strength set to the maximum) | - | 28 | - | mA |
| RPU | Resistance of internal pull-up resistor | - | 45 | - | k |
| RPD | Resistance of internal pull-down resistor | - | 45 | - | k |
| VIL_nRST | Low-level input voltage of CHIP_PU
to power off the chip | - | - | 0.6 | V |
1 Please see Appendix IO MUX of ESP32 Series Datasheet for IO's power domain. VDD is the I/O voltage for a particular power domain of pins.
2 For VDD3P3_CPU and VDD3P3_RTC power domain, per-pin current sourced in the same domain is
gradually reduced from around 40 mA to around 29 mA, VOH >=2.64 V, as the number of current- source pins increases.
3 Pins occupied by flash and/or PSRAM in the VDD_SDIO power domain were excluded from the test.
Address:
Baoan Internet Industry Base, Zao Community, Xixiang Street, Bao ′an District, Shenzhen, Guangdong, China
Business Type:
Manufacturer/Factory
Business Range:
Consumer Electronics, Electrical & Electronics, Industrial Equipment & Components, Light Industry & Daily Use, Lights & Lighting, Manufacturing & Processing Machinery, Service
Management System Certification:
ISO 9001, ISO 9000
Company Introduction:
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