No | Items | Capabilities(Order size/Delivery area <5m2) | Capabilities(Order size/Delivery area ≥5m2) |
1 | Materia l | HDI PCB material | IT-180A,S1000-2,TU-768(TU-752),TU-862HF,IT-170GRA1, S7439C,R-5775G,IT-968,TU-883,IT-988GSE,R-5785N, Meteorwave4000 | IT-180A,S1000-2,TU-768(TU-752),R-5775G,R-5785N |
2 | High CTI | S1151G(Halogen free)) | S1151G(Halogen free)) |
3 | PI material | VT-901,VT-90H,85N | VT-901,VT-90H,85N |
4 | HighSpeed material | TU-862 HF(Halogen free)),IT-170GRA1(Halogen free),FR408HR ,TU-872 SLK,R-5725S,TU-872 SLK SP,N4103-13,N4103-13 EP, N4103-13 SI,N4103-13 EPSI,N4800-20 SI,S7439C,R-5775G,IT- 968,R-5775N,IT-968 SE,TU-883,R-5775K,R-5785N, Meteorwave4000,IT-988G SE,TU-933+ | TU-862 HF(Halogen free)),IT-170GRA1(Halogen free)),TU-872 SLK, R-5725S,TU-872 SLK SP,N4103-13,N4103-13 EP,N4103-13 SI,N4103-13 EPSI,R-5775G,IT-968,R-5775N,IT-968 SE,TU-883,R-5785N, Meteorwave4000,IT-988G SE,TU-933+ |
5 | High Frequency CCL material | Aerowave 300,ZYC8300,ZYF3000CA-P,RO4730G3,RO4533,RO4533 Lopro,LNB33,S7136H,HC35,RO4350B,RO4350B Lopro,TLF-35,RF- 35,RF-35TC,RF-45,RF-60TC,TLY-5,RT5880,ZYF220D,DiClad 880 ,TLX-8,F4BM-2,RO4725JXR,RO4725JXR lopro,TLX-9,GF255, ZYF265D,TSM-DS3M,RT6002,TSM-DS3,RO4003C,RO4003C Lopro, mmWave77,RO3003,RT6010LM,AD1000,AD1000L,TP-2,TMM10 | Aerowave 300,RO4730G3,RO4533,RO4533 Lopro,S7136H,RO4350B, RO4350B Lopro,RF-35,RF-35TC,RF-45,RF-60TC,TLY-5,RT5880,DiClad 880,TLX-8,RO4725JXR,RO4725JXR lopro,TSM-DS3M,RT6002,RO4003C, RO4003C Lopro,RO3003,RT6010LM |
6 | High Frequency PP material | (FR-28-0040-50,FR-25-0021-45,FR-26-0025-60,FR-27-0045-35, FR-27-0050-40),Aerobond350,Synamic 6B,RO4450F | Synamic 6B,RO4450F |
7 | Metal substrate PCB | T110,T111,T1112,T112B,T112C,VT-4A1,VT-4A2,VT-4B3,VT-4B5 ,92MCL,1KA04,1KA06,1KA08,VT-4A2,T512, | T110,T111,T1112,T112B,T112C,VT-4A1,VT-4A2,VT-4B3,VT-4B5, 92MCL,1KA04,1KA06,1KA08VT-4A2,T512, |
8 | Metal substrate PCB PP | ST115B,VT-4A2,1KA04,1KA06,1KA08 | ST115B,VT-4A2,1KA04,1KA06,1KA0 |
9 | Hybrid laminating | Rogers,Taconic,Arlon,Nelco&fr4,high speed material & FR4, High Frequency material & high speed material | Rogers,Taconic,Arlon,Nelco FR-4,high speed material & FR4,High Frequency material & high speed material |
10 | PCB type | Rigid PCB | Backplane,HDI,High multi-layer blind&buried PCB,Embedded Capacitance,Embedded resistance board , Heavy copper power PCB,Backdrill,Semiconductor Test products. | Backplane,HDI,High multi-layer blind&buried PCB,Backdrill&Heavy copper power PCB |
11 | Buildin gs | Blind&buried via type | mechanical blind&burried vias with less than 3 times laminating | mechanical blind&burried vias with less than 2 times laminating |
12 | HDI | 1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating | 1+n+1,1+1+n+1+1,2+n+2((n buried vias≤0.3mm),Laser blind via can be filling plating |
No | Items | Capabilities(Order size/Delivery area <5m2) | Capabilities(Order size/Delivery area ≥5m2) |
13 | Surface Finish treatme nt | Surface Finish treatment(lead free) | Flash gold(electroplated gold),ENIG,Hard gold,Flash gold, HASL Lead free,OSP,ENEPIG,Soft gold, Immersion silver,Immersion Tin,ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge | Flash gold(electroplated gold),ENIG,Hard gold,Flash gold,HASL Lead free,OSP,ENEPIG,Soft gold, Immersion silver,Immersion Tin,ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge |
14 | Surface Finish treatment(leaded) | HASL | HASL |
15 | Aspect ratio | 10:1(HASL/Lead free HASL,ENIG,Immersion silver,Immersion Tin,ENEPIG);8:1(OSP) | 10:1(HASL/Lead free HASL,ENIG,Immersion silver,Immersion Tin, ENEPIG);8:1(OSP) |
16 | Max finished size | HASL/Lead free HASL 22"*24";gold finger 24"*24";hard gold 24"*32";ENIG 21"*27";FLASH GOLD21"*48";Immersion tin 16"*21";immersion silver:width max 24",length no limited; OSP 610*720mm; | HASL/Lead free HASL22"*24";gold finger 24"*24";hard gold 24"*32"; ENIG 21"*27";FLASH GOLD21"*48";Immersion tin 16"*21";immersion silver:width max 24",length no limited;OSP 610*720mm; |
17 | MIN finished size | HASL 5"*6";Lead free HASL 6"*10";gold finger 12"*16";hard gold 3"*3";FLASH GOLD 8"*10";Immersion tin/silver 2"*4"; OSP2"*2"; | HASL 5"*6";Lead free HASL 6"*10";gold finger 12"*16";hard gold 3"*3";FLASH GOLD 8"*10";Immersion tin/silver 2"*4";OSP2"*2"; |
18 | PCB thickness | HASL/Lead free HASL 0.6-4.0mm;gold finger 1.0-3.2mm;hard gold 0.1-8.0mm;ENIG 0.2-7.0mm;FLASH GOLD 0.15-5.0mm; Immersion tin 0.4-5.0mm;immersion silver 0.2-4.0mm;OSP 0.2- 6.0mm; | HASL/Lead free HASL 0.6-4.0mm;gold finger 1.0-3.2mm;hard gold 0.1- 5.0mm;ENIG 0.2-7.0mm;FLASH GOLD 0.15-5.0mm;Immersion tin 0.4- 5.0mm;immersion silver 0.2-4.0mm;OSP 0.2-6.0mm; |
19 | MAX high to gold finger | 1.5inch | 1.5inch |
20 | Min space between gold fingers | 5mil | 5mil |
21 | Min block space to gold fingers | 5mil | 5mil |
22 | Plating /coatin g thickne ss | HASL | 2-40μm (0.4μm on large tin area of Leaded HASL, 1.5μm on large tin area of HASL lead free) | 2-40μm (0.4μm on large tin area of Leaded HASL, 1.5μm on large tin area of HASL lead free) |
23 | OSP | osp thickness:0.2-0.6μm | osp thickness:0.2-0.6μm |
24 | ENIG | gold thickness :0.05-0.10μm,Nickelthickness :3-8μm | gold thickness :0.05-0.10μm,Nickelthickness :3-8μm |
25 | Immersion silver | silver thickness :0.15-0.4μm | silver thickness :0.15-0.4μm |
26 | Immersion tin | tin thickness :≥1.0 | tin thickness :≥1.0 |
27 | Hard gold | gold thickness :0.10-1.5μm(Dry film diagram plating process),gold thickness :0.10-4.0μm(no Dry film diagram plating process) | gold thickness :0.10-1.5μm(Dry film diagram plating process),gold thickness :0.10-4.0μm(no Dry film diagram plating process) |
28 | Soft gold | gold thickness :0.10-1.5μm(Dry film diagram plating process),gold thickness :0.10-4.0μm(no Dry film diagram plating process) | gold thickness :0.10-1.5μm(Dry film diagram plating process),gold thickness :0.10-4.0μm(no Dry film diagram plating process) |
29 | ENEPIG | gold thickness :0.05-0.10μm,Nickelthickness :3-8μm; pd thickness:0.05-0.15μm(welding) pd thickness:0.075-0.20μm(Gold wire bond) pd thickness:≥0.3μm(special function) | gold thickness :0.05-0.10μm,Nickelthickness :3-8μm; pd thickness:0.05-0.15μm(welding) pd thickness:0.075-0.20μm(Gold wire bond) pd thickness:≥0.3μm(special function) |
30 | Flash Gold | gold thickness :0.025-0.10μm,Nickelthickness :≥3μm,bass copper max thickness 1OZ | gold thickness :0.025-0.10μm,Nickelthickness :≥3μm,bass copper max thickness 1OZ |
No | | | Capabilities(Order size/Delivery area <5m2) | Capabilities(Order size/Delivery area ≥5m2) |
31 | Gold finger | gold thickness :0.25-1.5μm,Nickelthickness :≥3μm | gold thickness :0.25-1.5μm,Nickelthickness :≥3μm |
32 | Carbon | 10-50μm | 10-50μm |
33 | Soldermask | on copper area(10-18μm),on via pad(5-8μm),on circuits around the corner, ≥5μm ,just for one-time print & copper thickness need lower than 48um | on copper area(10-18μm),on via pad(5-8μm),on circuits around the corner, ≥5μm ,just for one-time print & copper thickness need lower than 48um |
34 | Blue plastic | 0.20-0.80mm | 0.2-0.4mm |
35 | Hole | 0.1/0.15/0.2mm MAX thickness of mechanical hole | 0.8mm/1.6mm/2.5mm | 0.6mm/1.2mm/1.6mm |
36 | Min laser drilling size | 0.1mm | 0.1mm |
37 | Max laser drilling size | 0.15mm | 0.15mm |
38 | Finshed mechanical hole size | 0.10-6.2mm(corresponding drilling tool size0.15-6.3mm) | 0.15-6.2mm(corresponding drilling tool size0.2-6.3mm) |
39 | A,Min finished hole size for PTFE material and hybrid PCB is 10mil(corresponding drilling tool size 14mil) | A,Min finished hole size for PTFE material and hybrid PCB is 10mil(corresponding drilling tool size 14mil) |
40 | B,Max finished hole size for blind & buried via is 12mil(corresponding drilling tool size 16mil) | B,Max finished hole size for blind & buried via is 12mil(corresponding drilling tool size 16mil) |
41 | C,Max finished hole size for via-in-pad pluged with solder mask is 18mil(corresponding drilling tool size 21.65mil | C,Max finished hole size for via-in-pad pluged with solder mask is 18mil(corresponding drilling tool size 21.65mil |
42 | D,Min connecting hole size is 14mil(corresponding drilling tool size is 18mil) | D,Min connecting hole size is 14mil(corresponding drilling tool size is 18mil) |
43 | E,Min half-hole(pth)size is 12mil(corresponding drilling tool size is 16mil) | E,Min half-hole(pth)size is 12mil(corresponding drilling tool size is 16mil) |
44 | MAX aspect ratio for Hole plate | 20:1(hole diameter>8mil) | 15:1 |
45 | Max aspect ratio for laser via filling plating | 1:1 | 0.9:1 |
46 | Max aspect ratio for mechanical depth-control drilling board(Blind hole drilling depth/blind hole size) | 1.3:1(hole diameter≤0.20mm),1.15:1(hole diameter≥0.25mm) | 0.8:1,hole diameter≥0.25mm |
47 | Min. depth of Mechanical depthcontrol(backdrill) | 0.2mm | 0.2mm |
48 | Min gap between hole wall and conductor (None blind and buried via PCB) | PIN-LAM:3.5mil(≤4L),4mil(5-8L),4.5mil(9-12L);5mil (13-16L),6mil(≥17L) | 7mil(≤8L),9mil(10-14),10mil(>14L) |
49 | Min gap between hole wall conductor (Blind and buried via PCB) | 7mil(1 time laminating), 8mil(2 times laminating), 9mil(3 times laminating) | 8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating) |
No | | | Capabilities(Order size/Delivery area <5m2) | Capabilities(Order size/Delivery area ≥5m2) |
50 | Min gab between hole wall conductor (Laser blind hole buried via PCB) | 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) | 7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2) |
51 | Min space between laser holes and conductor | 5mil | 6mil |
52 | Min space bwteen hole walls in different net | 10mil | 10mil |
53 | Min space bwteen hole walls in the same net | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) | 6mil(thru-hole& laser hole PCB),10mil(Mechanical blind&buried PCB) |
54 | Min space bwteen NPTH hole walls | 8mil | 8mil |
55 | Hole location tolerance | ±2mil | ±2mil |
56 | NPTH tolerance | ±2mil | ±2mil |
57 | Pressfit holes tolerance | ±2mil | ±2mil |
58 | Countersink depth tolerance | ±0.15mm | ±0.15mm |
59 | Countersink hole size tolerance | ±0.15mm | ±0.15mm |
60 | Pad(rin g) | Min Pad size for laser drillings | 10mil(for 4mil laser via),11mil(for 5mil laser via | 10mil(for 4mil laser via),11mil(for 5mil laser via |
61 | Min Pad size for mechanical drillings | 16mil(8mildiameter) | 16mil(8mildiameter) |
62 | Min BGA pad size | HASL:10mil,,Lead free min BGA (solder mask 16mil,etching 10mil), other surface technics are 7mi | HASL:10mil,Lead free min BGA (solder mask 16mil,etching 10mil), flash gold 7 mil,other surface technics are 10mil |
63 | Pad size tolerance(BGA) | +/-1.2mil(pad <12mil);+/-10%(pad≥12mil) | +/-1.5mil(pad<10mil);+/-15%(pad≥10mil) |
64 | | Inner layer | 1/2OZ:3/3mil | 1/2OZ: 3/3mil |
65 | 1OZ: 3/4mil | 1OZ: 3/4mil |
66 | 2OZ: 4/5mil | 2OZ: 4/5.5mil |
67 | 3OZ: 5/8mil | 3OZ: 5/8mil |
68 | 4OZ: 6/11mil | 4OZ: 6/11mil |
69 | 5OZ: 7/13.5mil | 5OZ: 7/14mil |
70 | 6OZ: 8/15mil | 6OZ: 8/16mil |
71 | 7OZ: 9/18mil | 7OZ: 9/19mil |
72 | 8OZ: 10/21mil | 8OZ: 10/22mil |
73 | 9OZ: 11/24mil | 9OZ: 11/25mil |
74 | 10OZ: 12/27mil | 10OZ: 12/28mil |
No | Width/S pace | | Capabilities(Order size/Delivery area <5m2) | Capabilities(Order size/Delivery area ≥5m2) |
75 | Outer layer | 1/3OZbase copper:3/3mil | 1/3OZbase copper:3.5/4mil |
76 | 1/2OZbase copper:3.5/3.5mil | 1/2OZbase copper:3.9/4.5mil |
77 | 1OZbase copper: 4.5/5mil | 1OZbase copper: 4.8/5.5mil |
78 | 1.43OZbase copper(positive):4.5/6 | 1.43OZbase copper(positive):4.5/7 |
79 | 1.43OZbase copper(negative):5/7 | 1.43OZbase copper(negative):5/8 |
80 | 2OZbase copper: 6/7mil | 2OZbase copper: 6/8mil |
81 | 3OZbase copper: 6/10mil | 3OZbase copper: 6/12mil |
82 | 4OZbase copper: 7.5/13mil | 4OZbase copper: 7.5/15mil |
83 | 5OZbase copper: 9/16mil | 5OZbase copper: 9/18mil |
84 | 6OZbase copper: 10/19mil | 6OZbase copper: 10/21mil |
85 | 7OZbase copper: 11/22mil | 7OZbase copper: 11/25mil |
86 | 8OZbase copper: 12/26mil | 8OZbase copper: 12/29mil |
87 | 9OZbase copper: 13/30mil | 9OZbase copper: 13/33mil |
88 | 10OZbase copper: 14/35mil | 10OZbase copper: 14/38mil |
89 | Width tolerance | ≤10mil:+/-1.0mil | ≤10mil:+/-20% |
90 | >10mil:+/-1.5mil | >10mil:+/-20% |
91 | Solderm ask | MAX drilling tool size for via filled with Soldermask (double side) | 0.9mm | 0.9mm |
92 | Soldermask color | Green matte/glossy, Black matte/glossy, Blue matte/glossy, Red, White,Yellow, | Green matte/glossy, Black matte/glossy, Blue matte/glossy, Red, White,Yellow, |
93 | Silkscreen color | White, Yellow, Black | White, Yellow, Black |
94 | MAX hole size for via filled with Blue glue aluminium | 5mm | 4.5mm |
95 | Finish hole size for via filled with resin | 0.1-1.0mm | 0.1-1.0mm |
96 | Max aspect ratio for via filled with resin board | 12:1 | 8:1 |
97 | Min width of soldermask dam | base copper≤0.5OZ:4mil(best3.5mil,solder mask can't be white/black),5.5mil(best is 5mil,black/white),8.0mil(on copper area) | base copper≤0.5OZ:4mil(best3.5mil,solder mask can't be white/black),5.5mil(best is 5mil,black/green),8.0mil(on copper area) |
98 | base copper1OZ:4mil(green),5mil(solder mask can't be white/black),5.5mil(black/white),8.0mil(on copper area) | base copper1OZ:4mil(green),5mil(solder mask can't be white/black),5.5mil(black/white),8.0mil(on copper area) |
99 | base copper1.43OZ:4mil(green),5.5(can't be black/white), 6mil(black/white),8.0mil(on copper area) | base copper1.43OZ:4mil(green),5.5(solder mask can't be white/black),6mil(black/white),8.0mil(on copper area) |
100 | base copper2-4OZ:6mil,8mil(on copper area) | base copper2-4OZ:6mil,8mil(on copper area) |
No | | | Capabilities(Order size/Delivery area <5m2) | Capabilities(Order size/Delivery area ≥5m2) |
101 | Routing | Min space of the V-CUT does not reveal the copper ( Central Line of v-cut to internal/external circuits,H means board thickness) | H≤1.0mm:0.3mm(20°V-CUT),0.33mm(30°),0.37mm(45°); | H≤1.0mm:0.3mm(20°V-CUT),0.33mm(30°),0.37mm(45°); |
102 | 1.0<H≤1.6mm:0.36mm(20°),0.4mm(30°),0.5mm(45°); | 1.0<H≤1.6mm:0.36mm(20°),0.4mm(30°),0.5mm(45°); |
103 | 1.6<H≤2.4mm:0.42mm(20°),0.51mm(30°),0.64mm(45°); | 1.6<H≤2.4mm:0.42mm(20°),0.51mm(30°),0.64mm(45°); |
104 | 2.4 | 2.4 |
105 | V-CUT symmetrical tolerance | ±4mil | ±4mil |
106 | MAX V-CUT lines | 100 | 100 |
107 | V-CUT angle tolerance | ±5° | ±5° |
108 | V-CUT angle | 20,30,45° | 20,30,45° |
109 | Gold finger bevelling | 20,30,45° | 20,30,45° |
110 | Gold finger bevelling tolerance | ±5° | ±5° |
111 | Min space of gold finger chamfering noninterference tab | 2.5mm | 7mm |
112 | Min gap between the side of gold finger and the shape edge line | 8mil | 10mil |
113 | Depth tolerance of depth-control groove milling | ±0.10mm | ±0.10mm |
114 | Routing tolerance (edge to edge) | ±4mil | ±4mil |
115 | Min tolerance for routing slot (PTH) | width/length tolerance ±0.13mm | width/length tolerance ±0.13mm |
116 | Min tolerance for routing slot (NPTH) | width/length tolerance ±0.10mm | width/length tolerance ±0.10mm |
117 | Min tolerance for drilling slot (PTH) | slotwidth±0.075mm;slotLength/slotwidth<2:slotLength+/- 0.1mm;slotLength/slotwidth≥2:slotLength+/-0.075mm | slotwidth±0.075mm;slotLength/slotwidth<2:slotLength+/-0.1mm; slotLength/slotwidth≥2:slotLength+/-0.075mm |
118 | Min tolerance for drilling slot (NPTH) | slotwidth±0.05mm;slotLength/slotwidth<2:slotLength+/- 0.075mm;slotLength/slotwidth≥2:slotLength+/-0.05mm | slotwidth±0.05mm;slotLength/slotwidth<2:slotLength+/-0.075mm; slotLength/slotwidth≥2:slotLength+/-0.05mm |
No | | | Capabilities(Order size/Delivery area <5m2) | Capabilities(Order size/Delivery area ≥5m2) |
119 | Local mixed pressur e | Min gap between mechanical hole wall and conductor (Local mixed pressure area) | ≤10L:14mil;12L:15mil;>12L:18mil | ≤10L:14mil;12L:15mil;>12L:18mil |
120 | Min gap between mechanical hole wall and the junction of local mixed pressure | ≤12L:12mil;>12L:15mil | ≤12L:12mil;>12L:15mil |
No | | | Capabilities(Delivery area <5m2) | Capabilities(Delivery area ≥5m2) |
137 | Others | Max finished copper thickness to internal&external layer | inner Layer:10 OZ;outer layer:11 OZ | inner Layer:4 OZ;outer layer:5 OZ |
138 | finished copper thickness to external layer | 12,18μmbase copper:≥35.8(reference value:35.8-42.5);≥ 40.4(reference value:40.4-48.5) | 12,18μmbase copper:≥35.8(reference value:35.8-42.5);≥40.4 (reference value:40.4-48.5) |
139 | 35,50,70μmbase copper:≥55.9;≥70;≥86.7 | 35,50,70μmbase copper:≥55.9;≥70;≥86.7 |
140 | 105,140μmbase copper:≥117.6;≥148.5 | 105,140μmbase copper:≥117.6;≥148.5 |
141 | Layer count | 1-40L | 1-20L |
142 | PCB thickness | 0.20-7.0mm(no solder mask);0.40-7.0mm(with solder mask); | 0.3-5.0(no solder mask),0.4-5.0(with solder mask); |
143 | PCB thickness tolerance(Normal ) | thickness±10%(>1.0mm);±0.1mm(≤1.0mm); | thickness±10%(>1.0mm);±0.1mm(≤1.0mm); |
144 | PCB thickness tolerance(Special ) | thickness±0.1mm(≤2.0mm);±0.15mm(2.1-3.0mm) | thickness±10%(≤2.0mm);±0.15mm(2.1-3.0mm) |
145 | Min finished PCB size | 10*10mm | 50*100mm |
146 | Max finished PCB size | 24.5*47inch | 24*47inch |
147 | ionic soil | ≤1ug/cm2 | ≤1ug/cm2 |
48 | Min bow&twist | 0.3%(This ability request same laminated plate type, symmetry laminated construction, the difference of symmetry layer Copper area within 10%, uniformity wiring , excluding the large area of copper and base material ,haven't plate and single panel, and the long side size≤ 21 inch) | 0.75% |
149 | Impedance tolerance | ±3Ω(<30Ω),±5%(≥60Ω),±7%(≥45Ω) | ±3Ω(<30Ω),±10%(≥30Ω); |
150 | Laser blind via size with filling plating | 4-5mil(priority4mil) | 4-5mil(priority 4mil) |
151 | Max aspect ratio for laser via filling plating | 1:1(Depth included copper thickness) | 1:1(Depth included copper thickness) |