Shenzhen Fr4 94V0 Multilayer Custom Rigid/Flex PCB Circuit Board Manufacturer with Design/Prototype
| US$1.50 - 9.50 | 2,000 Pieces (MOQ) |
Port:
Shenzhen, China
Production Capacity:
500000 Pieces/Month
Payment Terms:
T/T, Western Union, Paypal
Guangdong, China
Last Login Date:
Jul 21, 2017
Main Products:
PCBA, PCB, Printed Circuit Board, PCBA OEM/ODM, Smart Watch, LED, Solar Power Bank
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Product Description
Company Info
Address:
3 Floor, Block 3, Zhongtai Electronic Technology Park, Donghuan 1st Road, Longhua New District, Shenzhen, Guangdong, China
Business Type:
Manufacturer/Factory
Business Range:
Computer Products, Consumer Electronics, Electrical & Electronics
Management System Certification:
ISO 9001, ISO 14001
Company Introduction:
AirCloud Technology is the professional high-tech electronic company engaged in PCB Fab + Assembly, providing some of the most innovative printed circuit board technologies and highest quality standards found in the industry today.
AirCloud Tech PCBA Capabilities
· Surface Mount Line (SMT placement to 0201)
· BGA (Up to 508 X 457 mm)
· Through hole (manual and automated)
· Burn0in capabilities, thermal and life cycle
· Conformal coating (manual and automated)
· Ionization level testing
· Radio Frequency (RF), In Circuit Testing (ICT), Functional, & ATE Testing
· Aqueous PCBA cleaning
· FDA QSR compliant process validation and DHRs with full component traceability
Layers
Mass production: 2~58 layers / Pilot run: 64 layers
Max. Thickness
Mass production: 394mil (10mm) / Pilot run: 17.5mm
Material
FR-4 (Standard FR4, MID-Tg FR4, Hi-Tg FR4, Lead free assembly material), Halogen-Free, Ceramic filled, Teflon, Polyimide, BT, PPO, PPE, Hybrid, Partial hybrid, etc.
Min. Width/Spacing
Inner layer: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ)
Max. Copper Thickness
UL certificated: 6.0 OZ / Pilot run: 12OZ
Min. Hole Size
Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm)
Max. Panel Size
1150mm × 560mm
Aspect Ratio
18: 1
Surface Treatment
HASL / Immersion Gold / Immersion Tin / OSP / ENIG + OSP / Immersion Silver / ENEPIG / Gold Finger
Special Process
Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control.
AirCloud Tech PCBA Capabilities
· Surface Mount Line (SMT placement to 0201)
· BGA (Up to 508 X 457 mm)
· Through hole (manual and automated)
· Burn0in capabilities, thermal and life cycle
· Conformal coating (manual and automated)
· Ionization level testing
· Radio Frequency (RF), In Circuit Testing (ICT), Functional, & ATE Testing
· Aqueous PCBA cleaning
· FDA QSR compliant process validation and DHRs with full component traceability
Layers
Mass production: 2~58 layers / Pilot run: 64 layers
Max. Thickness
Mass production: 394mil (10mm) / Pilot run: 17.5mm
Material
FR-4 (Standard FR4, MID-Tg FR4, Hi-Tg FR4, Lead free assembly material), Halogen-Free, Ceramic filled, Teflon, Polyimide, BT, PPO, PPE, Hybrid, Partial hybrid, etc.
Min. Width/Spacing
Inner layer: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ)
Max. Copper Thickness
UL certificated: 6.0 OZ / Pilot run: 12OZ
Min. Hole Size
Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm)
Max. Panel Size
1150mm × 560mm
Aspect Ratio
18: 1
Surface Treatment
HASL / Immersion Gold / Immersion Tin / OSP / ENIG + OSP / Immersion Silver / ENEPIG / Gold Finger
Special Process
Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control.
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