Heating Furnace Body

SAIRUIDA diffusion furnace bodies are mainly used as heating devices for semiconductor, power elements and IC industry.

They can be assembled with multiple models of diffusion furnace such as U. S TEMPRESS, U. S TYAN, U. S THERMCO, Dutch ASM and British BTU etc.

The are made by advanced foreign process with carefully chosen imported materials which are able to deal with diffusion work for silicon wafers of 2~8 inch size.

Performance and Features
The are of many advantages such as long service life, stable temperature zone, reasonable structure and reliable performance, while could be fabricated according to custom requirements.