Digital Power Audio Amplifier Board
| FOB Price: | US$5.00-10.00 / Piece |
|---|---|
| Min. Order: | 1 Piece |
| Min. Order | FOB Price |
|---|---|
| 1 Piece | US$5.00-10.00/ Piece |
| Port: | Guangzhou, China |
|---|---|
| Production Capacity: | 5, 000, 000PCS/Year |
| Payment Terms: | L/C, T/T |
Product Description
Company Info
Product Description
| 1.PCB Layer | 1-16 Layer | Molding board thickness | 0.6-3.00mm | |
| 2.Min. trace width | 0.1mm | Min. solder mask dam | 0.1mm | |
| 3.Min. space width | 0.1mm | Min. solder mask clearance | 0.03mm | |
| 4.Min. trace to pad | 0.1mm | Min. solder mask thickness | 0.01mm | |
| 5.Min. drill diameter | 0.2mm | Min. Hole Size | 0.2mm | |
| 6.Min. via pad | 0.6mm | Min. silk legend width | 0.1mm | |
| 7.Max. board size | 560mmx720mm | Min. silk legend height | 0.6mm | |
| 8.Surface processing type | HASL/ plating gold /immersion gold/ Ni/ Au plating gold finger/ OSP processing/immersion Tin (Sn) | |||
| 9.Solder mask type | Green/yellow/black/red/white/blue or transparent photosensitive solder mask and peel off blue glue. | |||
| 10.Board Material | High TG board, high frequency board (ROGERS,TEFLON) halogen-free board (FR-4,CEM-1,CEM-3) | |||
| 11.Electricity performance testing | 100% electrical performance testing, high pressure testing | |||
| 12.Data file format | Data file format GERBER file and corresponding drilling file,PROTEL series, PADS2000,POWERPCB series,ODB++ | |||
| 13.Other testing request | Impendence testing, Hole resistance testing, gold slice up, Solder ability. | |||
| 14.PCB Assembly SMT & DIP manufacturing Capabilities: | ||||
| 15.Max. PCB Size | 410mm x 600mm | Min. PCB Thickness | 0.35mm | |
| 16.Max. BGA Size | 74 mm x 74mm | BGA Ball Pitch | 1mm ~ 3mm | |
| 17.QFP Lead Pitch | 0.38mm ~ 2.54mm | Min. IC Pitch | 0.30mm | |
| 18.Min. Chip Placement | 1005 | |||
| 19.Type of Assembly | SMT, Thru-hole, Cable assembly, Wire Harness | |||
| 20.Foot Pin | SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA | |||
| 21.Solder Type | Water Soluble Solder, Lead-Free, Wave soldering | |||
| 22.Components | Passive Down to 0201 size | |||
| BGA and VFBGA | ||||
| Leadless Chip Carriers/CSP/QFN | ||||
| Double-sided SMT Assembly | ||||
| Fine Pitch to 0.8mils | ||||
| BGA Repair and Reball | ||||
| Part Removal and Replacement | ||||
| 23.Component packaging | Cut Tape, Tube ,Reels, Loose Parts | |||
| 24.Programing | Hex file or bin file firmware. | |||
| 25.Testing | Flying Probe Test, X-ray Inspection AOI Test | |||
| 26.Package | Anti-static Bubble Bag & Carton | |||
| 27.PCB Assembly process | IQC for incoming materials checking---- Material baking ----SMT----- Semi-Products Testing & QC ---DIP parts -- IPQC--- Wave Soldering-- Semi-Products Testing & QC -----Assembling----ICT or Xray----- 100% Function Testing -----Reliability Testing (burn-testing) - Package - Shipping | |||
Address:
6f, Building B1, No. 11 Kaiyuan Avenue, Science City, Guangzhou, Guangdong, China
Business Type:
Manufacturer/Factory, Trading Company
Business Range:
Electrical & Electronics, Industrial Equipment & Components, Manufacturing & Processing Machinery
Management System Certification:
ISO 9001, ISO 14001
Company Introduction:
Guangzhou Sanjing Intelligent Electronic Technology Co Ltd is a manufacturer of PCBA with well-equipped testing facilities and strong technical force.
With a wide range, good quality reasonable prices and stylish designs our products are extensively used in car and other industries
Our products are widely recognized and trusted by users and can meet continuously changing economic and social needs
We welcome new and old customers from all walks of life to contact us for future business relationships and mutual success
With a wide range, good quality reasonable prices and stylish designs our products are extensively used in car and other industries
Our products are widely recognized and trusted by users and can meet continuously changing economic and social needs
We welcome new and old customers from all walks of life to contact us for future business relationships and mutual success
