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1A8 Resin Bond Diamond Blades

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Price

Min. Order Reference FOB Price

500 Pieces Negotiable

Sepcifications

Manufacturing Technology Logic IC
Material Element Semiconductor
Type N-type Semiconductor
Package PGA(Pin Grid Array Package)
Signal Processing Digital
Application Temperature Measurement
Model PC817
Batch Number 2007+
Trademark SAIL
Origin Suzhou

Product Description

We specialized in the research, development, production and sales of ultra precision diamond and CBN tools used in the industry of semiconductor. The products of resin bonded, metal bonded and electrodeposit ultra-thin and ultra-precision diamond wheels made by the company have been widely used ...

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Taizhou Sumeng Grinding Wheel Co., Ltd.

Gold Member Since 2006

Audited Supplier

Rating & Reviews： 3.0/5.0

(2 Reviews)

Business Type Manufacturer/Factory
Main Products Abrasives, Grinding Wheel, Diamond Wheel, Cut-off Wheel, Diamond Tool, CBN Wheel, Superabrasive, Cutting Wheel, Dicing Blade, Borazon Wheel
Registered Capital 8000000 RMB
Plant Area >2000 square meters
Management System Certification ISO 9001, ISO 14001, ISO 14000, OHSAS/ OHSMS 18001
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays

Cutting Baldes Comparison

	1A8 Resin Bond Diamond Blades Contact Now	Quick View Wholesale Silicon Wafer 50mm-300mm N-Type Prime Grade Silicon Wafer Contact Now	Quick View in Stock Cheaper 2" 3" 4" 6" 8" Single/Double Polished Silicon Wafer Contact Now	Quick View 2/4/6/8/12 Inch N Type Polished Silicon Wafer DSP Sio2 Silicon Oxide Wafer Contact Now	Quick View Monocrystalline Silicon Solar Modules Mono Wafer Diamond Wire Solar Panel Silicon Wafer Contact Now

Transaction Info
	1A8 Resin Bond Diamond Blades Contact Now	Quick View Wholesale Silicon Wafer 50mm-300mm N-Type Prime Grade Silicon Wafer Contact Now	Quick View in Stock Cheaper 2" 3" 4" 6" 8" Single/Double Polished Silicon Wafer Contact Now	Quick View 2/4/6/8/12 Inch N Type Polished Silicon Wafer DSP Sio2 Silicon Oxide Wafer Contact Now	Quick View Monocrystalline Silicon Solar Modules Mono Wafer Diamond Wire Solar Panel Silicon Wafer Contact Now
Price	Negotiable	US $ 1.00-100.00/ Piece	US $ 1.00-100.00/ Piece	US $ 1.00-100.00/ Piece	US $ 1.00-100.00/ Piece
Min Order	500 Pieces	25 Pieces	25 Pieces	25 Pieces	25 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T, Western Union	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal	T/T, Western Union, Paypal
Quality Control
Management System Certification	ISO 9001, ISO 14001, ISO 14000, OHSAS/ OHSMS 18001	ISO 9001	ISO 9001	ISO 9001	ISO 9001
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, Own Brand	Own Brand	Own Brand	Own Brand	Own Brand
Average Lead Time	Off-season: within 15 Day(s) Peak-season: 1 Month(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Manufacturing Technology: Logic IC; Material: Element Semiconductor; Type: N-type Semiconductor; Package: PGA(Pin Grid Array Package); Signal Processing: Digital; Application: Temperature Measurement; Model: PC817; Batch Number: 2007+;	Manufacturing Technology: Optoelectronic Semiconductor; Material: Compound Semiconductor; Type: Intrinsic Semiconductor; Package: SMD; Signal Processing: Analog Digital Composite and Function; Application: LED; Growth Method: CZ and Fz; Orientation: 111 or 100; Resistivity: 0.0005 to 150; Surface: Double Side Polished or Single Side Polished; Dopant: N Type and P Type; Particles: <30 at 0.3um; Bow: < 30 Um; Ttv: <15 Um;	Manufacturing Technology: Optoelectronic Semiconductor; Material: Compound Semiconductor; Type: Intrinsic Semiconductor; Package: SMD; Signal Processing: Analog Digital Composite and Function; Application: LED; Growth Method: CZ and Fz; Orientation: 111 or 100; Resistivity: 0.0005 to 150; Surface: Double Side Polished or Single Side Polished; Dopant: N Type and P Type; Particles: <30 at 0.3um; Bow: < 30 Um; Ttv: <15 Um;	Manufacturing Technology: Optoelectronic Semiconductor; Material: Compound Semiconductor; Type: Intrinsic Semiconductor; Package: SMD; Signal Processing: Analog Digital Composite and Function; Application: LED; Growth Method: CZ and Fz; Orientation: 111 or 100; Resistivity: 0.0005 to 150; Surface: Double Side Polished or Single Side Polished; Dopant: N Type and P Type; Particles: <30 at 0.3um; Bow: < 30 Um; Ttv: <15 Um;	Manufacturing Technology: Optoelectronic Semiconductor; Material: Compound Semiconductor; Type: Intrinsic Semiconductor; Package: SMD; Signal Processing: Analog Digital Composite and Function; Application: LED; Growth Method: CZ and Fz; Orientation: 111 or 100; Resistivity: 0.0005 to 150; Surface: Double Side Polished or Single Side Polished; Dopant: N Type and P Type; Particles: <30 at 0.3um; Bow: < 30 Um; Ttv: <15 Um;
Supplier Name	Taizhou Sumeng Grinding Wheel Co., Ltd.	Jiaozuo Commercial Finewin Co., Ltd.	Jiaozuo Commercial Finewin Co., Ltd.	Jiaozuo Commercial Finewin Co., Ltd.	Jiaozuo Commercial Finewin Co., Ltd.
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