Min. Order Reference FOB Price
1 Piece US$100,000.00-1,000,000.00 / Piece
Product Description
Product Description Laser Internal Modification Machine for SIC / Si wafer Equipment features: 1. Specially designed laser system 2. Excellent cutting effect 3. Fully automated production 4. High precision visual system; Automatic alignment and autofocus; High precision motion platform 5. ...