Min. Order Reference FOB Price
1 Piece US$100,000.00-1,000,000.00 / Piece
Product Description
Product Description Mainly used for all flattening process requirements in wafer chip manufacturing equipment, such as IMD, STI, ILD, BPSG, contact, metal line, etc., while supporting flattening processes in new fields such as TSV and MEMS. Product Features The entire machine has a compact ...