Min. Order Reference FOB Price
1 Piece US$550,000.00-1,000,000.00 / Piece
Product Description
This machine is a specialized equipment for semiconductor wafer Laser Grooving, designed as a fully automatic model, and adopts a plug type (customized special) material box feeding method. The equipment integrates high-performance, high-power, and ultra fast lasers, providing long-term stable and ...