Factory Self Developed Multi Chip Packaging Equipment Meets High-Precision Chip Mounting Requirements pictures & photos

Factory Self Developed Multi Chip Packaging Equipment Meets High-Precision Chip Mounting Requirements

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Price

Min. Order Reference FOB Price

1 Piece US$100,000.00-1,000,000.00 / Piece

Sepcifications

After-sales Service Provided
Condition New
Speed High Speed
Precision High Precision
Certification ISO
Warranty 12 Months
Automatic Grade Automatic
Transport Package Customized or Wooden Box Packaging
Specification Standard Specifications
Trademark Himalaya
Origin China
Product Name Semiconductor Equipment
Feature 1 Guaranteed Quality
Feature 2 Customized According to Needs
After-Sale Service Provided

Product Description

Product Description Equipment Specifications AUTOMOLD SHM8120(120T) Packaging quantity 2L/F/time/press Press quantity 1-4 presses Applicable L/F size Width:20-80mm Length:124-270mm Thickness:0.1-0.6mm Applicable resin size Diameter 11-20mm(±0.2mm)Aspect ratio:1.2-1.7(Max ...

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Jiangsu Himalaya Semiconductor Co., Ltd.

Gold Member Since 2023

Audited Supplier

Business Type Trading Company
Main Products Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Number of Employees 11
Year of Establishment 2019-09-12
Plant Area 83 square meters
Average Lead Time Peak Season Lead Time: 3-6 months
Off Season Lead Time: 1-3 months

Die Bonder Comparison

	Factory Self Developed Multi Chip Packaging Equipment Meets High-Precision Chip Mounting Requirements Contact Now	Quick View Surface Mounting Technology Machine with SMT Reel Feeders Neoden4 Pick Place Machine Contact Now	Quick View Portable Pick and Place Machine Neoden4 for PCB Placement Contact Now	Quick View Small Pick and Place Robots Neoden4 for SMD Mounting Assembly Production Line Contact Now	Quick View CE Approved Visual 4 Head SMD Pick and Place Machine Contact Now

Transaction Info
	Factory Self Developed Multi Chip Packaging Equipment Meets High-Precision Chip Mounting Requirements Contact Now	Quick View Surface Mounting Technology Machine with SMT Reel Feeders Neoden4 Pick Place Machine Contact Now	Quick View Portable Pick and Place Machine Neoden4 for PCB Placement Contact Now	Quick View Small Pick and Place Robots Neoden4 for SMD Mounting Assembly Production Line Contact Now	Quick View CE Approved Visual 4 Head SMD Pick and Place Machine Contact Now
Price	US $ 100,000.00-1,000,000.00/ Piece	US $ 7499/ Set	US $ 7499/ Set	US $ 7,499.00-9,697.00/ Set	US $ 7499/ Set
Min Order	1 Pieces	1 Sets	1 Sets	1 Sets	1 Sets
Trade Terms	-	FOB, CFR, CIF, FCA, EXW	FOB, CFR, CIF, FCA, EXW	FOB, CFR, CIF, FCA, EXW	FOB, CFR, EXW
Payment Terms	T/T	T/T, Paypal	T/T, Paypal	T/T, Paypal	T/T, Paypal, Money Gram
Quality Control
Product Certification	ISO	CE	CE	-	RoHS, CE
Management System Certification	-	ISO 9001, ISO 9000, ISO 20000, ISO 14064, QC 080000	ISO 9001, ISO 9000, ISO 20000, ISO 14064, QC 080000	ISO 9001, ISO 9000, ISO 20000, ISO 14064, QC 080000	ISO 9001, ISO 9000, ISO 20000, ISO 14064, QC 080000
Trade Capacity
Export Markets	Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	Others	ODM, Own Brand	ODM, Own Brand	ODM, Own Brand	ODM, Own Brand
Average Lead Time	Off-season: 1-3 Month(s) Peak-season: 1-3 Month(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	After-sales Service: Provided; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Product Name: Semiconductor Equipment; Feature 1: Guaranteed Quality; Feature 2: Customized According to Needs; After-Sale Service: Provided;	After-sales Service: 2 Years; Condition: New; Speed: Medium Speed; Precision: High Precision; Warranty: 24 Months; Automatic Grade: Automatic; Type: Medium-speed Chip Mounter; Pick Nozzle Qty: 4; Tape Reel Feeder Qty: 48, on Base All Are 8mm Feeders; Vibrating Feeder Qty: 5; Tray IC Capacity: 5; Component Size with Vision: 0201~Tqfp144; Placement Speed: 5000cph/H with Vision; Components' Height: 5mm; Positioning Accuracy: +/-0.02mm; PCB Area: 310X1500mm with Internal Rails; Placement Area: 140X1500mm with 1 Waffle Tray;	After-sales Service: 2 Years; Condition: New; Speed: Medium Speed; Precision: High Precision; Warranty: 24 Months; Automatic Grade: Automatic; Type: Medium-speed Chip Mounter; Pick Nozzle Qty: 4; Tape Reel Feeder Qty: 48, on Condition All Are 8mm; Vibrating Feeder Qty: 5; Tray IC Capacity: 5; Component Size with Vision: 0201, Tqfp; Placement Speed: 5000cph/H with Vision; Components' Height: 5mm; Positioning Accuracy: +/-0.02mm; PCB Area: 310X1500mm with Internal Rails; Placement Area: 140X1500mm with 1 Waffle Tray;	Machine: Prototype Pick and Place; Tape Reel Feeder Qty: 48, on Condition All Are 8mm Feeders; Vibrating Feeder Qty: 5; Tray IC Capacity: 5; Component Size with Vision: 0201~Tqfp144; Placement Speed: 5000cph/H with Vision; Components' Height: 5mm; Positioning Accuracy: +/-0.02mm; PCB Area: 290X1500mm with Internal Rails; Placement Area: 140X1500mm with 1 Waffle Tray;	After-sales Service: 2 Years Warranty; Condition: New; Speed: Medium Speed; Precision: High Precision; Warranty: 24 Months; Automatic Grade: Automatic; Type: Medium-speed Chip Mounter; Placement Head Qty: 4PCS; Tape Reel Feeders Qty: 48; Applicable Components: 0201,BGA,Soic,Ssop,Qfn,Tqfp,LED; Max Height: 5mm; Support Tube Packed IC Feeder: 5; Tray IC Feeder Qty: 45; Placement Area: 310X400mm Without Tray, 140X400 with 1 Waffle; Power Supply: 110/220V, 50Hz, 180W; Tape Width: 8/12/16/24mm; Packing Size: 94X74X65cm; Application: PCB Assembly, SMT Production Line;
Supplier Name	Jiangsu Himalaya Semiconductor Co., Ltd.	Zhejiang NeoDen Technology Co., Ltd.	Zhejiang NeoDen Technology Co., Ltd.	Zhejiang NeoDen Technology Co., Ltd.	Zhejiang NeoDen Technology Co., Ltd.
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