Die Bonder
US$100,000.00-1,000,000.00 / Piece
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What is Automatic High Precision Die Bonder Die Bonding Machine for Qfp/Lqfp/Qfn

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$100,000.00-1,000,000.00 / Piece

Sepcifications

  • After-sales Service Provided
  • Condition New
  • Precision High Precision
  • Certification ISO
  • Warranty 12 Months
  • Automatic Grade Automatic
  • Transport Package Customized or Wooden Box Packaging
  • Specification Standard Specifications
  • Trademark Himalaya
  • Origin China
  • Product Name Semiconductor Equipment
  • Feature 1 Guaranteed Quality
  • Feature 2 Customized According to Needs
  • After-Sale Service Provided

Product Description

Product Description DA1201 IC Linear High Precision Die Attach Wafer size: 6"- 12"; Dual dispensing system; High-precision linear driven bond head; Support DAF function; Multifunction work table, suitable for different kinds of lead frames &substrates; High-precision wafer table with ...

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Die Bonder Comparison
Transaction Info
Price US $ 100,000.00-1,000,000.00/ Piece Negotiable Negotiable Negotiable Negotiable
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms T/T T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal
Quality Control
Product Certification ISO - - - -
Management System Certification - ISO 9001, ISO 9000, ISO 14001 ISO 9001, ISO 9000, ISO 14001 ISO 9001, ISO 9000, ISO 14001 ISO 9001, ISO 9000, ISO 14001
Trade Capacity
Export Markets Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model Others OEM OEM OEM OEM
Average Lead Time Off-season: 1-3 Month(s)
Peak-season: 1-3 Month(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
After-sales Service: Provided;
Condition: New;
Precision: High Precision;
Warranty: 12 Months;
Automatic Grade: Automatic;
Product Name: Semiconductor Equipment;
Feature 1: Guaranteed Quality;
Feature 2: Customized According to Needs;
After-Sale Service: Provided;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Supplier Name

Jiangsu Himalaya Semiconductor Co., Ltd.

China Supplier - Gold Member Audited Supplier

SMT PARTS SUPPLY LTD

China Supplier - Gold Member Audited Supplier

SMT PARTS SUPPLY LTD

China Supplier - Gold Member Audited Supplier

SMT PARTS SUPPLY LTD

China Supplier - Gold Member Audited Supplier

SMT PARTS SUPPLY LTD

China Supplier - Gold Member Audited Supplier