ADSL Modem

US$20.00-100.00 / Square Meter

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12 Layers Thick Copper-Plated Gold Power Supply PCB Board pictures & photos

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What is 12 Layers Thick Copper-Plated Gold Power Supply PCB Board

Name: 12 Layers Thick Copper-Plated Gold Power Supply PCB Board
Uploaded: 2024-05-20T19:01:14+08:00
Description: process capability item number main project production capacity ultimate capacity 1 thickness of plating 0.2-3.0 mm 6.3 mm 2 copper thickness capacity 1/3-2 oz 4 oz 3 hole copper thickness 15-25 um

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About this Item

Price

Min. Order Reference FOB Price

1 Square Meter US$20.00-100.00 / Square Meter

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Computer
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Epoxy Resin
Brand Ht
Transport Package Vacuum Packaging
Specification 485.5*200mm
Trademark our own brand
Origin China
Test 100%
IP Class-2 Yes
Customization Available
Layers Upto 24 Layers

Product Description

process capability item number main project production capacity ultimate capacity 1 thickness of plating 0.2-3.0 mm 6.3 mm 2 copper thickness capacity 1/3-2 oz 4 oz 3 hole copper thickness 15-25 um 15-70 um 4 minium line with 0.089/0.089 mm(3.5 mil) 0.075/0.075 mm(3.0 mil) 5 ...

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Dongguan Yaochen Technology Industry Co., Ltd.

Gold Member Since 2023

Audited Supplier

Rating & Reviews： 5.0/5.0

(1 Reviews)

Business Type Manufacturer/Factory, Trading Company
Main Products PCB Board, Pet Protective Film, BOPET Release Film, Plastic Film, Double Sided PCB Board, Optical Release Film, Multilayer PCB Board, EVA Foam Tape, Heat Resistant Tape
Registered Capital 11000000 RMB
Plant Area >2000 square meters
Management System Certification ISO 9001, ISO 14001
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays

ADSL Modem Comparison

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Transaction Info
	Quick View 12 Layers Thick Copper-Plated Gold Power Supply PCB Board Contact Now	Quick View Customized Design PCBA Printed Circuit Mother Board Supplier in Shenzhen Contact Now	Quick View Shenzhen 94V0 RoHS Printed Circuit Board PCBA Assembly Contact Now	Quick View Mass Production PCBA Factory for Electronic Device PCB PCBA Provide PCBA Components Assembly Service Contact Now	Quick View OEM Manufacturer Industrial Android PCBA Motherboard Rk3288 Digital Signage Android Control Board SMT DIP Assembly Contact Now
Price	US $ 20.00-100.00/ Square Meter	US $ 0.98-5.00/ Piece	US $ 0.15-15.00/ Piece	US $ 1.06-5.00/ Piece	US $ 0.57-6.00/ Piece
Min Order	1 Square Meters	10 Pieces	10 Pieces	10 Pieces	10 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, Western Union, Paypal, Money Gram	T/T	T/T, D/P, Paypal, Money Gram	T/T	T/T
Quality Control
Product Certification	-	RoHS, CCC, ISO	RoHS, CCC, ISO	RoHS, CCC, ISO	RoHS, CCC, ISO
Management System Certification	ISO 9001, ISO 14001	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485	ISO 9001, IATF16949, ISO 13485
Trade Capacity
Export Markets	South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	Domestic	Domestic	Domestic	Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM, Own Brand, Others	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: 1 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)	Off-season: 1 Month(s) Peak-season: 1-3 Month(s)
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Computer; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Ht; Test: 100%; IP Class-2: Yes; Customization: Available; Layers: Upto 24 Layers;	Type: Customized; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Customized; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Customized; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Customized; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Customized; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Customized; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Customized; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Customized; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;
Supplier Name	Dongguan Yaochen Technology Industry Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.
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