ADSL Modem
US$20.00-100.00 / Square Meter
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Gold Finger +OSP Bevel Angle 20 Degree 6 Layers of Gold Finger Black Oil Plate Graphics Card Connector PCB Board pictures & photos
Gold Finger +OSP Bevel Angle 20 Degree 6 Layers of Gold Finger Black Oil Plate Graphics Card Connector PCB Board pictures & photos
Gold Finger +OSP Bevel Angle 20 Degree 6 Layers of Gold Finger Black Oil Plate Graphics Card Connector PCB Board pictures & photos
Gold Finger +OSP Bevel Angle 20 Degree 6 Layers of Gold Finger Black Oil Plate Graphics Card Connector PCB Board pictures & photos
Gold Finger +OSP Bevel Angle 20 Degree 6 Layers of Gold Finger Black Oil Plate Graphics Card Connector PCB Board pictures & photos
Gold Finger +OSP Bevel Angle 20 Degree 6 Layers of Gold Finger Black Oil Plate Graphics Card Connector PCB Board pictures & photos
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What is Gold Finger +OSP Bevel Angle 20 Degree 6 Layers of Gold Finger Black Oil Plate Graphics Card Connector PCB Board

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About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Square Meter US$20.00-100.00 / Square Meter

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Communication
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Ht
  • Transport Package Vacuum Packaging
  • Specification 600*600mm
  • Trademark our own brand
  • Origin China
  • Test 100%
  • IP Class-2 Yes
  • Customization Available
  • Layers Upto 24 Layers

Product Description

process capability item number main project production capacity ultimate capacity 1 thickness of plating 0.2-3.0 mm 6.3 mm 2 copper thickness capacity 1/3-2 oz 4 oz 3 hole copper thickness 15-25 um 15-70 um 4 minium line with 0.089/0.089 mm(3.5 mil) 0.075/0.075 mm(3.0 mil) 5 ...

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Transaction Info
Price US $ 20.00-100.00/ Square Meter US $ 0.50-1.00/ Piece US $ 0.50-6.00/ Piece US $ 0.50-6.00/ Piece US $ 0.10-0.50/ Piece
Min Order 1 Square Meters 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, Western Union, Paypal, Money Gram T/T, D/P, Western Union, Paypal T/T, D/P, Western Union, Paypal T/T, D/P, Western Union, Paypal T/T, D/P, Western Union, Paypal
Quality Control
Management System Certification ISO 9001, ISO 14001 ISO 9001, IATF16949 ISO 9001, IATF16949 ISO 9001, IATF16949 ISO 9001, IATF16949
Trade Capacity
Export Markets South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia
Annual Export Revenue - - - - -
Business Model OEM, ODM, Own Brand, Others OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: 1 Month(s)		 - - - -
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Ht;
Test: 100%;
IP Class-2: Yes;
Customization: Available;
Layers: Upto 24 Layers;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: New Chip;
Capacity: 1000000;
OEM/ODM: Available;
Sample: Available;
Surface Treatment: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
Test: 100%E-Testing;
Min Bonding Pad Diameter: 10mil;
Min Thickness of Soldermask: 10um;
Color of Silk-Screen: White, Yellow, Black;
Data File Format: Gerber File and Drilling File, Protel Series, ...;
Material for PCB: Fr-4, Halogen Free, Rogers, Cem-1, Ari;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: New Chip;
Capacity: 1000000;
OEM/ODM: Available;
Sample: Available;
Surface Treatment: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
Test: 100%E-Testing;
Min Bonding Pad Diameter: 10mil;
Min Thickness of Soldermask: 10um;
Color of Silk-Screen: White, Yellow, Black;
Data File Format: Gerber File and Drilling File, Protel Series, ...;
Material for PCB: Fr-4, Halogen Free, Rogers, Cem-1, Ari;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: New Chip;
Capacity: 1000000;
OEM/ODM: Available;
Sample: Available;
Surface Treatment: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
Test: 100%E-Testing;
Min Bonding Pad Diameter: 10mil;
Min Thickness of Soldermask: 10um;
Color of Silk-Screen: White, Yellow, Black;
Data File Format: Gerber File and Drilling File, Protel Series, ...;
Material for PCB: Fr-4, Halogen Free, Rogers, Cem-1, Ari;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Supplier Name

Dongguan Yaochen Technology Industry Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzhen New Chip international Ltd

China Supplier - Diamond Member Audited Supplier

Shenzhen New Chip international Ltd

China Supplier - Diamond Member Audited Supplier

Shenzhen New Chip international Ltd

China Supplier - Diamond Member Audited Supplier

Shenzhen New Chip international Ltd

China Supplier - Diamond Member Audited Supplier

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