Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersion Gold;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Teck: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
|
Type: Rigid Circuit Board;
Material: Fr4;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Hl-PCB;
Surface Treatment: Immersion Tin;
Mini Hole Diameter: 0.2mm;
Borad Thickness: 1.0mm;
Count Layer: 8;
Inner/Outer Copper Thickness: 1oz/1oz;
Min Trace Width/Spacing: 3mil/3mil;
Special: Golden Finger Board, Impedance Control, BGA;
|
Type: Rigid Circuit Board;
Material: Fr4;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Hl-PCB;
Surface Treatment: Immersion Gold;
Mini Hole Diameter: 0.2mm;
Borad Thickness: 1.0mm;
Count Layer: 4;
Inner/Outer Copper Thickness: 1oz/1oz;
Min Trace Width/Spacing: 5mil/5mil;
Special: High Tg Board, Strick Appearance Inspection;
Certificated: ISO9001, ISO14001, CQC, IATF16949, UL, RoHS etc.;
|
Type: Combining Rigid Circuit Board;
Material: Fr4;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Hl-PCB;
Surface Treatment: Immersion Gold;
Mini Hole Diameter: 0.3mm;
Borad Thickness: 1.6mm;
Count Layer: 3;
Inner/Outer Copper Thickness: 1oz/1oz;
Min Trace Width/Spacing: 0.3mm/0.3mm;
Special: Rigid Flex Mix Material;
|
Type: Rigid Circuit Board;
Material: Fr4-Kb;
Application: Automotive Application;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Hl-PCB;
Surface Treatment: Immersion Au;
Mini Hole Diameter: 0.2mm;
Borad Thickness: 1.6mm;
Count Layer: 4;
Inner/Outer Copper Thickness: 1oz/1oz;
Min Trace Width/Spacing: 5mil/5mil;
Special: Balck Printing Ink, Resin Plug Vias;
Certificated: ISO9001, ISO14001, CQC, IATF16949, UL, RoHS etc.;
|