Specification |
Metal Coating: Tin;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Copper Weight: 18um, 25um, 35um, 70um;
Surface Treatment: OSP/HASL/Lf HASL/Enig/Imm Tin etc;
Soldermask Color: White, Black, Green, Blue etc.;
Finished Thickness: 0.8~1.6mm;
Waveform: Pure Sine Wave;
Input Voltage: 12V/24V/36V/48V;
Output Voltage: 110V/220V;
Frequency: 50Hz/60Hz;
Key Words: Inverter Circuit Board PCBA;
Communication: R485/R232/Can;
LCD Display: Optional;
Dimension: Customizable;
Power: Customizable;
Charging Current: Customizable;
Remote Control: Optional;
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Metal Coating: Standard;
Mode of Production: SMT;
Layers: Standard;
Base Material: Standard;
Customized: Customized;
Condition: New;
Power: 6W;
Number of Lamp Beads: 14PCS;
SMT Electrolysis 8000h: 2.2UF 400V;
Current: 100-120mA;
Supplier Type: One-Stop Service;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Production Time: Within 4 Weeks;
Copper Thickness: 1-4oz;
Keywords: Multilayer Electronic Circuit Board;
Certificate: ISO 13485;
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Metal Coating: Tin;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Brand: Exceeding;
Certificate: ISO9001, ISO14001, IATF16949, ISO13485.;
Solder Mask Color: Green, White, Black, Blue, Red(Customized);
Board Thickness: 0.2mm-8.0mm;
Copper Thickness: 0.5-100oz(18-3500um);
PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex, Irreg;
Layer: 1-36 Layers;
Max. PCB Size: 1900mm*600mm;
Surface Finishing: HASL Lead Free, Immersion Gold/Silver.OSP.;
Industrial: Industrial, Control Board, Motherboard.;
Design: PCBA Layout and Engineering Support.;
PCB Type: Rigid PCB, HDI PCB, Flexible PCB;
PCBA Testing: in-Circuit Test (Ict), Functioal Test (Fct), X-ray;
Service: PCB, Components Sourcing, Assembly, Test, Package;
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