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What is High-Density Interconnect PCB Assembly and PCB for Data Centers

Name: High-Density Interconnect PCB Assembly and PCB for Data Centers
Uploaded: 2024-04-18T16:14:26+08:00
Description: Product Description This PCB are 6mm thickness Metal edging Copper thickness is 8oz Our advantages 1)Thickness copper PCB Max Single side PCB copper thickness is 8.0mm/0.035=228oz (Quantity

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Price

Min. Order Reference FOB Price

1 Piece US$0.10-1.00 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Consumer Electronics
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Immersion Gold
Base Material Fr4
Insulation Materials Epoxy Resin
Transport Package Box
Trademark hemeixin
Origin China
Copper Thickness 3oz -105oz
Surface Finish Gold Finger
Special Teck Metal Edging
Special 1 Blind Hole
Special 2 Buried Vias
Special 3 Flex-Rigid PCB

Product Description

Product Description This PCB are 6mm thickness Metal edging Copper thickness is 8oz Our advantages 1)Thickness copper PCB Max Single side PCB copper thickness is 8.0mm/0.035=228oz (Quantity produces) Max Double side pcb copper thickness is 3.0mm/0.035=85oz (Quantity produces) 2) ...

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Shenzhen Hemeixin Electronic Co., Limited

Diamond Member Since 2024

Audited Supplier

Business Type Manufacturer/Factory
Main Products PCB, Cables, PCBA
Registered Capital 1000000 RMB
Plant Area >2000 square meters
Management System Certification ISO 9001
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

PCB Assembly Comparison

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Transaction Info
	Quick View High-Density Interconnect PCB Assembly and PCB for Data Centers Contact Now	Quick View Custom Service Fabrication TV Electronic PCB with OEM Contact Now	Quick View Tg170 PCBA Circuit with Enig Edge Plating Multilayer PCB Contact Now	Quick View Custom Service Fabrication MPPT Solar Charger Electronic PCB with OEM Contact Now	Quick View PCB Scrap Am FM Radio PCB Circuit with Great Manufacturer Contact Now
Price	US $ 0.10-1.00/ Piece	US $ 0.39-2.19/ Piece	US $ 0.39-2.19/ Piece	US $ 0.39-2.19/ Piece	US $ 0.39-2.19/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	L/C, T/T, Western Union	T/T, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal, Money Gram
Quality Control
Management System Certification	ISO 9001	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Immersion Gold; Base Material: Fr4; Insulation Materials: Epoxy Resin; Copper Thickness: 3oz -105oz; Surface Finish: Gold Finger; Special Teck: Metal Edging; Special 1: Blind Hole; Special 2: Buried Vias; Special 3: Flex-Rigid PCB;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Medical Instruments; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Szx; Layers: Multilayer; Solder Marsk: Green, Black, Blue, Red, Yellow, White; Hole: Mechanical Hole, Laser Hole; Assembly: Components; Processing: SMT and DIP; Surface Treatment: HASL, Immersion Gold, OSP; Service Providing: PCB Production, PCB Assembly, Components Sourcing;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Medical Instruments; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Szx; Layers: Multilayer; Solder Marsk: Green, Black, Blue, Red, Yellow, White; Hole: Mechanical Hole, Laser Hole; Assembly: Components; Processing: SMT and DIP; Surface Treatment: HASL, Immersion Gold, OSP; Service Providing: PCB Production, PCB Assembly, Components Sourcing;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Medical Instruments; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Szx; Layers: Multilayer; Solder Marsk: Green, Black, Blue, Red, Yellow, White; Hole: Mechanical Hole, Laser Hole; Assembly: Components; Processing: SMT and DIP; Surface Treatment: HASL, Immersion Gold, OSP; Service Providing: PCB Production, PCB Assembly, Components Sourcing;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Medical Instruments; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Szx; Layers: Multilayer; Solder Marsk: Green, Black, Blue, Red, Yellow, White; Hole: Mechanical Hole, Laser Hole; Assembly: Components; Processing: SMT and DIP; Surface Treatment: HASL, Immersion Gold, OSP; Service Providing: PCB Production, PCB Assembly, Components Sourcing;
Supplier Name	Shenzhen Hemeixin Electronic Co., Limited	Shenzexin Electronic (Hongkong) Co., Ltd.	Shenzexin Electronic (Hongkong) Co., Ltd.	Shenzexin Electronic (Hongkong) Co., Ltd.	Shenzexin Electronic (Hongkong) Co., Ltd.
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