Specification |
Metal Coating: Copper;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Type: Rigid Circuit Board;
Dielectric: Fr-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Insulation Materials: Epoxy Resin;
Processing Technology: Immersion Gold;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Technology: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Customized: Customized;
Condition: New;
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Metal Coating: Silver;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Surface Finishing: HASL;
Application: Custom;
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Metal Coating: Silver;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Surface Finishing: HASL;
Application: Custom;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Model No.: Rigid Circuit Board;
Insulation Materials: Epoxy Resin;
Surface Treatment: HASL/HASL Lead Free, Chemical Tin, Chemical Gold;
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Test: 100% E-Test,X-ray, Aoi, in-Circuit Test (Ict), Fun;
Board Thickness: 0.2mm-6mm;
Solder Mask: Green,Black,White,etc.;
Copper Thickness: 0.5oz-100oz;
Application: Consumer Electronics;
PCBA QA: Full Test Include Aoi, in-Circuit Test (Ict);
PCB Type: Rigid PCB, HDI PCB, Flexible PCB, Rigid-Flexible;
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