Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Jhwl;
Surface Finish: HASL, Enig, OSP;
Solder Mask: Green/Black/White/Red/Blue/Yellow;
Biggest Panel Size: 610mm*508mm;
Hole Posito: +/-0.075mm(3mil) CNC Driling;
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Type: Rigid Circuit Board;
Dielectric: Rogers Material;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: RO5880;
Insulation Materials: Epoxy Resin;
Brand: Kxpcba;
Shape: Rectangular, Round, Slots, Cutouts, Complex;
Surface Treatment: HASL, Lf HASL, Enig, OSP, Carbon Oil;
PCB Testing: E-Test, Fly Probe Test, Visual Checking;
Min. Hole Size: 0.1mm(4mil) for HDI / 0.15mm(6mil);
Copper Thickness: 0.5-12oz(18-420um);
Board Thickness: 0.2-6.0mm;
Min. Line Width: 0.075mm(3mil);
Min. Line Spacing: 0.075mm(3mil);
Min Width of Annular Ring: 0.15mm(6mil);
Service: 7*24 Hours Online;
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Type: Rigid Circuit Board;
Dielectric: Rogers Material;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: RO5880;
Insulation Materials: Epoxy Resin;
Brand: Kxpcba;
Shape: Rectangular, Round, Slots, Cutouts, Complex;
Surface Treatment: HASL, Lf HASL, Enig, OSP, Carbon Oil;
PCB Testing: E-Test, Fly Probe Test, Visual Checking;
Min. Hole Size: 0.1mm(4mil) for HDI / 0.15mm(6mil);
Copper Thickness: 0.5-12oz(18-420um);
Board Thickness: 0.2-6.0mm;
Min. Line Width: 0.075mm(3mil);
Min. Line Spacing: 0.075mm(3mil);
Min Width of Annular Ring: 0.15mm(6mil);
Service: 7*24 Hours Online;
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Type: Rigid Circuit Board;
Dielectric: Rogers Material;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: RO5880;
Insulation Materials: Epoxy Resin;
Brand: Kxpcba;
Shape: Rectangular, Round, Slots, Cutouts, Complex;
Surface Treatment: HASL, Lf HASL, Enig, OSP, Carbon Oil;
PCB Testing: E-Test, Fly Probe Test, Visual Checking;
Min. Hole Size: 0.1mm(4mil) for HDI / 0.15mm(6mil);
Copper Thickness: 0.5-12oz(18-420um);
Board Thickness: 0.2-6.0mm;
Min. Line Width: 0.075mm(3mil);
Min. Line Spacing: 0.075mm(3mil);
Min Width of Annular Ring: 0.15mm(6mil);
Service: 7*24 Hours Online;
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Type: Rigid Circuit Board;
Material: Fr4;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Hl-PCB;
Surface Treatment: Immersion Gold;
Mini Hole Diameter: 0.3mm;
Borad Thickness: 0.1mm;
Count Layer: 4;
Inner/Outer Copper Thickness: 1oz/1oz;
Min Trace Width/Spacing: 5mil/5mil;
Certificated: ISO9001, ISO14001, CQC, IATF16949, UL, RoHS etc.;
Special: Mini Connector;
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