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US$2.60-54.80 / Piece
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FPC Manufacturer Flexible PCB Circuit Boards PCB Design and Software Development pictures & photos
FPC Manufacturer Flexible PCB Circuit Boards PCB Design and Software Development pictures & photos
FPC Manufacturer Flexible PCB Circuit Boards PCB Design and Software Development pictures & photos
FPC Manufacturer Flexible PCB Circuit Boards PCB Design and Software Development pictures & photos
FPC Manufacturer Flexible PCB Circuit Boards PCB Design and Software Development pictures & photos
FPC Manufacturer Flexible PCB Circuit Boards PCB Design and Software Development pictures & photos
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What is FPC Manufacturer Flexible PCB Circuit Boards PCB Design and Software Development

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About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$2.60-54.80 / Piece

Sepcifications

  • Type Rigid Circuit Board, Rigid Circuit Board
  • Dielectric FR-4, Fr-4
  • Material Fiberglass Epoxy Resin + Polyimide Resin, Fiberglass Epoxy
  • Application Consumer Electronics, Medical Instruments
  • Flame Retardant Properties V0, V0
  • Mechanical Rigid Rigid, Rigid
  • Processing Technology Electrolytic Foil, Electrolytic Foil
  • Base Material Aluminum, Aluminum
  • Insulation Materials Epoxy Resin, Epoxy Resin
  • Transport Package OEM
  • Specification 35*25*27
  • Trademark JHWL
  • Origin China
  • Brand Jhwl
  • Surface Finish HASL, Enig, OSP
  • Solder Mask Green/Black/White/Red/Blue/Yellow
  • Biggest Panel Size 610mm*508mm
  • Hole Posito +/-0.075mm(3mil) CNC Driling

Product Description

Company Profile LED display Product Parameters Item Specification 1 Number of Layer 1-26Layers(standard) 2 Material FR3,Aluminum ,FPC 3 Surface Finish HASL(LF),Gold plating,Enig ,lmmersion gold,lmmersion Tin,OSP 4 Finish Board Thickness ...

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Transaction Info
Price US $ 2.60-54.80/ Piece US $ 0.10-10.00/ Piece US $ 0.10-10.00/ Piece US $ 0.10-10.00/ Piece US $ 0.10-10.00/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms T/T, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal, XT L/C, T/T, D/P, Western Union, Paypal, XT L/C, T/T, D/P, Western Union, Paypal, XT L/C, T/T, D/P, Western Union, Paypal, Money Gram, XT
Quality Control
Management System Certification ISO 9001, ISO 14001, IATF16949, ISO 13485 - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand
Average Lead Time - Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)		 Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)		 Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)		 Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Type: Rigid Circuit Board, Rigid Circuit Board;
Dielectric: FR-4, Fr-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin, Fiberglass Epoxy;
Application: Consumer Electronics, Medical Instruments;
Flame Retardant Properties: V0, V0;
Mechanical Rigid: Rigid, Rigid;
Processing Technology: Electrolytic Foil, Electrolytic Foil;
Base Material: Aluminum, Aluminum;
Insulation Materials: Epoxy Resin, Epoxy Resin;
Brand: Jhwl;
Surface Finish: HASL, Enig, OSP;
Solder Mask: Green/Black/White/Red/Blue/Yellow;
Biggest Panel Size: 610mm*508mm;
Hole Posito: +/-0.075mm(3mil) CNC Driling;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Sy Fr4;
Insulation Materials: Organic Resin;
Brand: Kxpcba;
Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt;
Copper Weights: 0.5oz~10oz;
Layer Count: 1-64 Layers;
Stack up: Control Dielectric/Control Impedance/Tdr Testing;
Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers;
Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res;
Stack Via: 5step;
Stagger Via: 5step;
Laser Via Hole Size: 0.1mm;
Filling Via Dimple Value: <=15um;
Laser Via Capture Pad Size: 0.25mm;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Sy Fr4;
Insulation Materials: Organic Resin;
Brand: Kxpcba;
Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt;
Copper Weights: 0.5oz~10oz;
Layer Count: 1-64 Layers;
Stack up: Control Dielectric/Control Impedance/Tdr Testing;
Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers;
Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res;
Stack Via: 5step;
Stagger Via: 5step;
Laser Via Hole Size: 0.1mm;
Filling Via Dimple Value: <=15um;
Laser Via Capture Pad Size: 0.25mm;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Sy Fr4;
Insulation Materials: Organic Resin;
Brand: Kxpcba;
Material Brand: Sy / Rogers/ Arlon / Polymide / Aluminum / Kapt;
Copper Weights: 0.5oz~10oz;
Layer Count: 1-64 Layers;
Stack up: Control Dielectric/Control Impedance/Tdr Testing;
Surface Finish: HASL/Enig/Enepig/Hard Gold/Wire Bonded Gold/Immers;
Vias: Blind-Buried/Via-in-Pad/Pofv/Filled-Vias/Epoxy Res;
Stack Via: 5step;
Stagger Via: 5step;
Laser Via Hole Size: 0.1mm;
Filling Via Dimple Value: <=15um;
Laser Via Capture Pad Size: 0.25mm;
Type: Rigid Circuit Board;
Dielectric: Rogers Material;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: RO5880;
Insulation Materials: Epoxy Resin;
Brand: Kxpcba;
Shape: Rectangular, Round, Slots, Cutouts, Complex;
Surface Treatment: HASL, Lf HASL, Enig, OSP, Carbon Oil;
PCB Testing: E-Test, Fly Probe Test, Visual Checking;
Min. Hole Size: 0.1mm(4mil) for HDI / 0.15mm(6mil);
Copper Thickness: 0.5-12oz(18-420um);
Board Thickness: 0.2-6.0mm;
Min. Line Width: 0.075mm(3mil);
Min. Line Spacing: 0.075mm(3mil);
Min Width of Annular Ring: 0.15mm(6mil);
Service: 7*24 Hours Online;
Supplier Name

Shenzhen Jiehao Future Technology Co., Ltd

China Supplier - Diamond Member Audited Supplier

Shenzhen Jinxiong Electronic Co., Ltd

China Supplier - Gold Member Audited Supplier

Shenzhen Jinxiong Electronic Co., Ltd

China Supplier - Gold Member Audited Supplier

Shenzhen Jinxiong Electronic Co., Ltd

China Supplier - Gold Member Audited Supplier

Shenzhen Jinxiong Electronic Co., Ltd

China Supplier - Gold Member Audited Supplier

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