Multilayer PCB
US$0.01-5.00 / piece
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What is Multilayer PCB Print Circuit Board Bare PCB for Electronic Main Board

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 piece US$0.01-5.00 / piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Auto
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Abis
  • Transport Package Vacuum Packing
  • Specification 240*200
  • Trademark ABIS CIRCUITS CO., LTD
  • Origin Shenzhen, China
  • Thickness Tolerance(T≥0.8mm) +/-8%
  • Thickness Tolerance(T<0.8mm) +/-10%
  • Insulation Layer Thickness 0.075mm--5.00mm
  • SMT Mini.Solder Mask Width 0.075mm
  • Mini. Solder Mask Clearance 0.05mm

Product Description

Multilayer PCB Print Circuit Board Bare PCB for Electronic Main Board Technical &Capability Item Production Capacity Layer Counts 1-20 layers Material FR-4,Cu base,High TG FR-4,PTFE,Rogers,TEFLON etc. Board thickness 0.20mm-8.00mm Maximum Size 600mmX1200mm Board Outline Tolerance ...

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Multilayer PCB Comparison
Transaction Info
Price US $ 0.01-5.00/ piece US $ 0.10-1.00/ Piece US $ 0.10-1.00/ Piece US $ 0.10-1.00/ Piece US $ 0.10-1.00/ Piece
Min Order 1 piece 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram, 30 days net L/C, T/T, Western Union L/C, T/T, Western Union L/C, T/T, Western Union L/C, T/T, Western Union
Quality Control
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 9000, ISO 14001 ISO 9001, ISO 9000, ISO 14001 ISO 9001, ISO 9000, ISO 14001 ISO 9001, ISO 9000, ISO 14001
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe
Annual Export Revenue US$50 Million - US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million
Business Model OEM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Auto;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Thickness Tolerance(T&ge;0.8mm): +/-8%;
Thickness Tolerance(T<0.8mm): +/-10%;
Insulation Layer Thickness: 0.075mm--5.00mm;
SMT Mini.Solder Mask Width: 0.075mm;
Mini. Solder Mask Clearance: 0.05mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersion Gold;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Teck: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersion Gold;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Teck: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersion Gold;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Teck: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersion Gold;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Teck: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Supplier Name

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hemeixin Electronic Co., Limited

Gold Member Audited Supplier

Shenzhen Hemeixin Electronic Co., Limited

Gold Member Audited Supplier

Shenzhen Hemeixin Electronic Co., Limited

Gold Member Audited Supplier

Shenzhen Hemeixin Electronic Co., Limited

Gold Member Audited Supplier