Polymide
US$0.01-150.00 / Piece
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What is Manufacturer PCB Printed Circuits Boards with UL ISO RoHS Compliant

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.01-150.00 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Transport Package Vacuum Packing
  • Specification Custom
  • Trademark ABIS CIRCUITS CO., LTD
  • Origin Shenzhen, China
  • Holes Specification Buried/Blind Vias, Via in Pads, Counter Sink Hole
  • Copper Thickness 0.5-8oz
  • Eng Thickness 1-3u
  • Board Thickness 0.2-6mm
  • Hard Gold Thickness 5-50u
  • Certification UL, ISO9001&ISO14001, SGS, RoHS, Ts16949

Product Description

ABIS: One-Stope Service from PCB fabricate to PCB assembly Company profile Why Chose us High-end euipment-high speed Pick and Place Machines that can process about 25,000 SMD components per hour High efficient supply ability 60K Sqm monthly-Offers low volume and on-demand PCB ...

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Polymide Comparison
Transaction Info
Price US $ 0.01-150.00/ Piece US $ 0.60-0.65/ Piece US $ 2/ Piece US $ 2/ Piece US $ 2/ Piece
Min Order 1 Pieces 10 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms T/T T/T L/C, T/T, Western Union L/C, T/T, Western Union L/C, T/T, Western Union
Quality Control
Product Certification UL, ISO9001&ISO14001, SGS, RoHS, Ts16949 - - - -
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001 ISO 9001 ISO 9001
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe - South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM OEM, ODM OEM OEM OEM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
- Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Copper Thickness: 0.5-8oz;
Eng Thickness: 1-3u;
Board Thickness: 0.2-6mm;
Hard Gold Thickness: 5-50u;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Shengyi, Kb, Gdm, Nouya, Rogers, etc.;
Criteria: Aql II 0.65;
Hole Sizes: 0.15mm/0.2mm;
Bevel Edge: Yes;
Impedance: 50/90/100 Ohm;
Trace Width(Min.): 4mil;
Surfaec Treatment: Enig;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersion Gold;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Teck: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersion Gold;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Teck: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersion Gold;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Teck: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Supplier Name

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Xinmanda Printed Circuit Board Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Hemeixin Electronic Co., Limited

China Supplier - Diamond Member Audited Supplier

Shenzhen Hemeixin Electronic Co., Limited

China Supplier - Diamond Member Audited Supplier

Shenzhen Hemeixin Electronic Co., Limited

China Supplier - Diamond Member Audited Supplier