PCB
US$0.50-1.00 / Piece
View

Quick Turn Double Sided Fr4 High Tg Fr4 Rigid Printed Circuit Board Green Soder Mask PCB Video

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.50-1.00 / Piece

Sepcifications

  • Structure Double-Sided Rigid PCB
  • Dielectric FR-4
  • Material Polyester Glass Fiber Mat Laminate
  • Application Aerospace
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Abis
  • Transport Package Vacuum Packing
  • Trademark ABIS CIRCUITS CO., LTD
  • Origin Shenzhen, China
  • Board Thickness 1.6mm
  • Copper Thickness 35um/1oz
  • Surface Finish HASL Lead Free
  • Solder Mask Green/Blue
  • Legend White
  • Customized Customized

Product Description

Quick Turn Double Sided Fr4 High Tg Fr4 Rigid Printed Circuit Board Green Soder Mask PCB Product Application 1, Security monitor: Moible phone, PDA, GPS, caramer monitor etc; 2, Telecom Communication :wireless LAN card, XDSL router,Servers, Optical Device,Hard Drive etc; 3, ...

Learn More

PCB Comparison
Transaction Info
Price US $ 0.50-1.00/ Piece US $ 0.1/ Piece US $ 0.1/ Piece US $ 0.1/ Piece US $ 0.1/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram, 30 days net L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001 ISO 9001 ISO 9001 ISO 9001
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia
Annual Export Revenue - - - - -
Business Model OEM OEM OEM OEM OEM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Aerospace;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Board Thickness: 1.6mm;
Copper Thickness: 35um/1oz;
Surface Finish: HASL Lead Free;
Solder Mask: Green/Blue;
Legend: White;
Customized: Customized;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Phenolic Paper Laminate;
Application: Computer;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Zitrok;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Phenolic Paper Laminate;
Application: Computer;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Zitrok;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Phenolic Paper Laminate;
Application: Computer;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Zitrok;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Phenolic Paper Laminate;
Application: Computer;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Zitrok;
Supplier Name

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Zitrok Electronics Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Zitrok Electronics Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Zitrok Electronics Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Zitrok Electronics Co., Ltd.

China Supplier - Diamond Member Audited Supplier