PCB Assembly
US$0.01-150.00 / Piece
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Qualified Printed Circuits Board for Power Amplifier PCB with UL Certificates Video

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.01-150.00 / Piece

Sepcifications

  • Structure Double-Sided Rigid PCB
  • Dielectric FR-4
  • Material Polyester Glass Fiber Mat Laminate
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand N/a
  • Transport Package Vacuum Packaging
  • Specification ISO9001& ISO14001& SGS& UL
  • Trademark ABIS CIRCUITS CO., LTD
  • Origin Made in China
  • Surface Finishing HASL
  • Field Power Amplifier PCB
  • Mask Green
  • Silk White

Product Description

Qualified printed circuits board for power amplifier PCB with UL certificates 1. Single, Double side &Multi-layer PCB. 2. Buried/Blind Vias, Via in Pad, Counter Sink Hole, Screw Hole(Counterbore), Press-fit, Half Hole. 3. HASL lead-free, Immersion Gold/ Silver/Tin, OSP, Gold plating/finger, ...

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PCB Assembly Comparison
Transaction Info
Price US $ 0.01-150.00/ Piece US $ 1.00-2.00/ Piece US $ 0.19-1.99/ Piece US $ 1.80-22.00/ Piece US $ 1.60-18.00/ Piece
Min Order 1 Pieces 1000 Pieces 1 Pieces 100 Pieces 100 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal
Quality Control
Product Certification - RoHS, ISO9001:2000 - - -
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 20000 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, IATF16949, ISO 13485 ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe South America, Europe, Africa Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM OEM, ODM OEM, ODM, Own Brand OEM, ODM OEM, ODM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: 6-12 Month(s)
Peak-season: 6-12 Month(s)
Off-season: within 15 Day(s)
Peak-season: 1 Month(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: N/a;
Surface Finishing: HASL;
Field: Power Amplifier PCB;
Mask: Green;
Silk: White;
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Zsan;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Communication;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
Structure: HDI PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Enig+OSP;
Production Process: Blind&Buried Vias;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Layer Count: 4layer - 64layer;
HDI Structure: 1+N+1 to Any Layer;
Min. Trace/Space: 2/2mil;
Structure: HDI PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Enig;
Production Process: Blind&Buried Vias;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Layer Count: 4layer - 8layer;
HDI Structure: 1+N+1 to Any Layer;
Min. Trace/Space: 2/2mil;
Special Material: Em825;
Blind/Buried Vias: 0.1mm Laser Drilling;
Supplier Name

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Yueqing Page Electrical Co., Ltd.

China Supplier - Gold Member Audited Supplier

Canm Technology Co.,Ltd

China Supplier - Gold Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier