Specification |
Structure: Multilayer FPC;
Material: Fr4, Cem1, Cem3 Aluminum HDI;
Combination Mode: Adhesive Flexible Plate;
Application: Consumer Electronics, Electronics Device;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Layer: 1-20L;
Surface Finishing: Enig, HASL, Lf-HASL;
Board Thickness: 0.1~0.2mm;
Solder Mask Color: Green Black Red, Black.Red.Yellow.White.Blue.Green;
Service: One-Stop Service, 24hours Technical Services;
Min. Line Spacing: 0.003", 0.15mm, 0.05 mm;
Min. Hole Size: 0.25mm, 0.1mm, 6mil;
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Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: No;
Width: 250mm;
Length: 100m;
Thickness: 25um 50um;
Size: Customized;
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Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V1;
Processing Technology: Electrolytic Foil;
Base Material: Pi;
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Structure: Double-Sided FPC;
Material: Copper;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Cable;
Flame Retardant Properties: V0;
Processing Technology: Des;
Base Material: Polyimide;
Insulation Materials: Polyimide;
Brand: Flex Plus;
Copper Thickness: 1/3 Oz ~2 Oz;
Length: Max. 4m (XL Exposure Machine);
Line Width: Min 0.05mm;
Solder Mask Color: Yellow, Black;
Sample Delivery: 3~5days;
MP Delivery: 7~10days;
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Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V1;
Processing Technology: Electrolytic Foil;
Base Material: Pi;
Insulation Materials: Organic Resin;
Brand: Newtrue;
Copper Thickness: 35um,1oz,2oz;
Min. Hole Size: 0.15mm;
Min. Line Width: 0.075mm(3mil);
Min. Line Spacing: 0.075mm(3mil);
Layer: 1~8 Layers;
Color: Yellow;
PCB Assembly: Through-Hole;
Solder Heat Resistance: 10 Sec;
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