CTI600 Tg170 Tg180 Multilayer Ipc Class 3 Immersion Gold Circuit Board Video

Name: CTI600 Tg170 Tg180 Multilayer Ipc Class 3 Immersion Gold Circuit Board
Uploaded: 2023-10-05T17:45:35+08:00
Description: CTI600 FR4 TG170 TG180 Multilayer PCB Board IPC Class 3 Immersion Gold Circuit Board 1. Single, Double side & Multi-layer PCB. 2. Buried/Blind Vias, Via in Pad, Counter Sink Hole, Screw Hole(Counter

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Price

Min. Order Reference FOB Price

1 Piece US$0.10 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Consumer Electronics
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Brand Abis
Transport Package Vacuum Packaging
Specification ISO9001& ISO14001& TS16949 & UL
Origin Made in China
PCB Material Fr4
Layer 4 Layer
Impedance Control Yes
Buried& Blind Vias No
Copper 0.5oz Base Copper+1.0oz Plated
Hard Gold N/a

Product Description

CTI600 FR4 TG170 TG180 Multilayer PCB Board IPC Class 3 Immersion Gold Circuit Board 1. Single, Double side &Multi-layer PCB. 2. Buried/Blind Vias, Via in Pad, Counter Sink Hole, Screw Hole(Counterbore), Press-fit, Half Hole. 3. HASL lead-free, Immersion Gold/ Silver/Tin, OSP, Gold ...

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Abis Circuits Co., Ltd.

Diamond Member Since 2017

Audited Supplier

Rating & Reviews: 3.0/5.0

(1 Reviews)

Business Type Manufacturer/Factory
Business Range Consumer Electronics, Electrical & Electronics, Health & Medicine, Industrial Equipment & Components, Instruments & Meters, Lights & Lighting, Security & Protection
Main Products Yes
Management System Certification ISO 9001, ISO 14001, IATF16949
Export Year 2006-10-04

PCBA Comparison

	CTI600 Tg170 Tg180 Multilayer Ipc Class 3 Immersion Gold Circuit Board Contact Now	Medical Device Printed Circuit Board One-Stop Service PCB PCBA Contact Now	Electronics PCBA Manufacturing Service Assembly SMT DIP PCB Contact Now	One-Top Printed Circuit Board SMT Electronics Components Service PCBA Manufacturing Contact Now	OEM&ODM Manufacturing PCB Assembly PCBA PCB Board Contact Now

Transaction Info
	CTI600 Tg170 Tg180 Multilayer Ipc Class 3 Immersion Gold Circuit Board Contact Now	Medical Device Printed Circuit Board One-Stop Service PCB PCBA Contact Now	Electronics PCBA Manufacturing Service Assembly SMT DIP PCB Contact Now	One-Top Printed Circuit Board SMT Electronics Components Service PCBA Manufacturing Contact Now	OEM&ODM Manufacturing PCB Assembly PCBA PCB Board Contact Now
Price	US $ 0.1/ Piece	US $ 2.68-5.60/ Piece	US $ 2.68-5.60/ Piece	US $ 2.68-5.60/ Piece	US $ 2.68-5.60/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Payment Terms	L/C, T/T, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram, Ali Pay	L/C, T/T, D/P, Western Union, Paypal, Money Gram, Ali Pay	L/C, T/T, D/P, Western Union, Paypal, Money Gram, Ali Pay	L/C, T/T, D/P, Western Union, Paypal, Money Gram, Ali Pay
Quality Control
Product Certification	-	RoHS/ISO9001/Ts16949/ISO14001/ISO13485	RoHS/ISO9001/Ts16949/ISO14001/ISO13485	RoHS/ISO9001/Ts16949/ISO14001/ISO13485	RoHS/ISO9001/Ts16949/ISO14001/ISO13485
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949, ISO 13485	ISO 9001, ISO 14001, IATF16949, ISO 13485	ISO 9001, ISO 14001, IATF16949, ISO 13485	ISO 9001, ISO 14001, IATF16949, ISO 13485
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	-	-	-	-
Annual Export Revenue	US$50 Million - US$100 Million	Above US$100 Million	Above US$100 Million	Above US$100 Million	Above US$100 Million
Business Model	OEM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	-	-	-	-
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Brand: Abis; PCB Material: Fr4; Layer: 4 Layer; Impedance Control: Yes; Buried& Blind Vias: No; Copper: 0.5oz Base Copper+1.0oz Plated; Hard Gold: N/a;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Mustar; Copper Thickness: 1-12 Oz; Board Thickness: 0.8, 1.0, 1.2, 1.6, 2, 2.4mm; Surface Finishing: HASL,Immersion Gold,Flash Gold, Plated Silver, OSP; Minimum Line Spacing: 0.015mm; Minimum Line Width Spacing: 0.015mm; Testing Service: Ict, Function Test, X-ray, Aoi; MOQ: 1PCS; Layers: 1-64; Warranty: 2 Years;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Mustar; Copper Thickness: 1-12 Oz; Board Thickness: 0.8, 1.0, 1.2, 1.6, 2, 2.4mm; Surface Finishing: HASL,Immersion Gold,Flash Gold, Plated Silver, OSP; Minimum Line Spacing: 0.015mm; Minimum Line Width Spacing: 0.015mm; Testing Service: Ict, Function Test, X-ray, Aoi; MOQ: 1PCS; Layers: 1-64; Warranty: 2 Years;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Mustar; Copper Thickness: 1-12 Oz; Board Thickness: 0.8, 1.0, 1.2, 1.6, 2, 2.4mm; Surface Finishing: HASL,Immersion Gold,Flash Gold, Plated Silver, OSP; Minimum Line Spacing: 0.015mm; Minimum Line Width Spacing: 0.015mm; Testing Service: Ict, Function Test, X-ray, Aoi; MOQ: 1PCS; Layers: 1-64; Warranty: 2 Years;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Mustar; Copper Thickness: 1-12 Oz; Board Thickness: 0.8, 1.0, 1.2, 1.6, 2, 2.4mm; Surface Finishing: HASL,Immersion Gold,Flash Gold, Plated Silver, OSP; Minimum Line Spacing: 0.015mm; Minimum Line Width Spacing: 0.015mm; Testing Service: Ict, Function Test, X-ray, Aoi; MOQ: 1PCS; Layers: 1-64; Warranty: 2 Years;
Supplier Name	Abis Circuits Co., Ltd.	Mu Star (shenzhen) Industry Co., Ltd.	Mu Star (shenzhen) Industry Co., Ltd.	Mu Star (shenzhen) Industry Co., Ltd.	Mu Star (shenzhen) Industry Co., Ltd.
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