Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Application: Computer;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Copper Thickness: 0.5 Oz-6 Oz;
Board Layer: 1-20 Layer;
Board Thickness: 0.3mm-3.0mm;
Max PCB Size: 600*600mm;
Surface Finish: Enig;
Solder Mask: Yellow;
Others: Gold Finger;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
The Capacity of Production: 50, 000sqm. /Month;
Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS);
Sample Date: 5-7days;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Flame Retardant Properties: V0;
Insulation Materials: Organic Resin;
The Capacity of Production: 50, 00sqm. /Month;
PP Thickness: 7628(0.18mm) 2116(0.12mm) 1080(0.08mm);
Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS);
Sample Date: 5-7days;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Flame Retardant Properties: V0;
The Capacity of Production: 50, 000sqm. /Month;
Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS);
Sample Date: 5-7days;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Flame Retardant Properties: V0;
The Capacity of Production: 50, 000sqm. /Month;
Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS);
Sample Date: 5-7days;
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