Multilayer Enepig Industrial Control Motherboard PCB Electronics Circuit Board Video

Name: Multilayer Enepig Industrial Control Motherboard PCB Electronics Circuit Board
Uploaded: 2023-08-23T10:48:22+08:00
Description: Multilayer ENEPIG Industrial Control Motherboard PCB Electronics Circuit Board 1. Single, Double side & Multi-layer PCB. 2. Buried/Blind Vias, Via in Pad, Counter Sink Hole, Screw Hole(Counterbore),

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$0.01-150.00 / Piece

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Epoxide Woven Glass Fabric Laminate
Application Consumer Electronics
Flame Retardant Properties V0
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Epoxy Resin
Transport Package Vacuum Packaging
Specification ISO9001& ISO14001& SGS& UL
Trademark ABIS CIRCUITS CO., LTD
Origin Made in China
Surface Finishing Enepig
Solder Mask Type Lpi
Surface Finished HASL, Enig, Chem. Tin, Flash Gold, OSP, Gold Finge
Board Thickness 0.20mm--8.00mm

Product Description

Multilayer ENEPIG Industrial Control Motherboard PCB Electronics Circuit Board 1. Single, Double side &Multi-layer PCB. 2. Buried/Blind Vias, Via in Pad, Counter Sink Hole, Screw Hole(Counterbore), Press-fit, Half Hole. 3. HASL lead-free, Immersion Gold/ Silver/Tin, OSP, Gold plating/finger, ...

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Abis Circuits Co., Ltd.

Diamond Member Since 2017

Audited Supplier

Rating & Reviews: 3.0/5.0

(1 Reviews)

Business Type Manufacturer/Factory
Business Range Consumer Electronics, Electrical & Electronics, Health & Medicine, Industrial Equipment & Components, Instruments & Meters, Lights & Lighting, Security & Protection
Main Products Yes
Management System Certification ISO 9001, ISO 14001, IATF16949
Export Year 2006-10-04

Enepig PCB Comparison

	Multilayer Enepig Industrial Control Motherboard PCB Electronics Circuit Board Contact Now	Double Side Thickness Board Printed Circuit Board Manufacturing PCB Contact Now	Multilayers HASL-Lf PCB Circuit Board Contact Now	4 Layers Telephone Main Board PCB Fabrication PCB Contact Now	FL-Rogers Material RO4003c PCB Board in Stock with Fast Supply Contact Now

Transaction Info
	Multilayer Enepig Industrial Control Motherboard PCB Electronics Circuit Board Contact Now	Double Side Thickness Board Printed Circuit Board Manufacturing PCB Contact Now	Multilayers HASL-Lf PCB Circuit Board Contact Now	4 Layers Telephone Main Board PCB Fabrication PCB Contact Now	FL-Rogers Material RO4003c PCB Board in Stock with Fast Supply Contact Now
Price	US $ 0.01-150.00/ Piece	US $ 0.86-2.48/ Piece	US $ 8.58-8.60/ Piece	US $ 0.24-0.36/ Piece	US $ 3.97-4.76/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Payment Terms	T/T, Western Union, Paypal	L/C, T/T, Western Union, Paypal	L/C, T/T, Western Union, Paypal	L/C, T/T, Western Union, Paypal	L/C, T/T, Western Union, Paypal
Quality Control
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	US$50 Million - US$100 Million	-	-	-	-
Business Model	OEM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Epoxide Woven Glass Fabric Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Finishing: Enepig; Solder Mask Type: Lpi; Surface Finished: HASL, Enig, Chem. Tin, Flash Gold, OSP, Gold Finge; Board Thickness: 0.20mm--8.00mm;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Delay Pressure Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Board Thickness: 1.6mm; Board Layer: 1 Layers; Copper Thickness: 1 Oz; Solder Mask: White; Silksreen: Black; Surface Finihsing: Enig; Lead Time: 6-8 Working Days;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Fr4; Insulation Materials: Epoxy Resin; Board Thickness: 1.6mm; Board Layer: 4 Layers; Copper Thickness: 1 Oz; Solder Mask: Blue; Silksreen: White; Surface Finihsing: HASL-Lf; Lead Time: 6-8 Working Days; Min. Line Width/Space: 0.05mm; Min. Hole Size: 0.05mm; Board Material: Fr4; Test: Aoi Test;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Medical Instruments; Flame Retardant Properties: HB; Processing Technology: Electrolytic Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Organic Resin; Board Material: Fr4; Board Layer: 2; Board Thickness: 0.3mm; Copper Thickness: 1 Oz; Min. Line Width/Space: 0.1mm; Min. Hole Size: 0.2mm; Solder Mask: Any Color; Silkscreen: Any Color; Surface Finishing: HASL-Lf; Lead Time: 8-10 Working Days; Service: One Stop;	Structure: Double-Sided Rigid PCB; Dielectric: FR-3; Material: Phenolic Paper Laminate; Application: Computer; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Semi-Additive Process; Base Material: Fr4; Insulation Materials: Organic Resin; Brand: Fastline; Board Material: Fr4; Layers: 1 to 30 Layers; Board Thickness: 1.6mm; Copper Thickness: 1oz; Solder Mask: Green; Silk Screen: White; Surface Treatment: HASL Lead Free; Test: 100%; Lead Time: 6-8 Working Days; Min. Line Width: 0.075mm;
Supplier Name	Abis Circuits Co., Ltd.	Fastline Circuits Co., Limited	Fastline Circuits Co., Limited	Fastline Circuits Co., Limited	Fastline Circuits Co., Limited
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